EP3SE260F1517C2N vs EP3SE260F1517C4 对比

详细并排对比 EP3SE260F1517C2N 出自 Intel 和 EP3SE260F1517C4 出自 Altera。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260F1517C2N EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N - Stratix III E FPGA 255K LE 1517-FCBGA | Intel

EP3SE260F1517C2N ⚠ 最后一次采购

规格对比

参数 EP3SE260F1517C2N EP3SE260F1517C4
品牌 Intel Altera
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $4,750.00 $8,400.00
Family Stratix III E Stratix® III E FPGA
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10,200 —
Total Memory Bits 16,672,768 —
Maximum User I/Os 976 —
Core Voltage 1.1 V —
Process Technology 65 nm —
Maximum Core Frequency 600 MHz —
封装 1517-ball FC-BGA 1517-BBGA, FCBGA
安装类型 Surface Mount Surface Mount
Operating Temperature Grade Commercial (0C to +85C) —
Configuration Interface Passive Serial, Fast Passive Parallel, JTAG, Active Serial —
Lead Free Yes —
RoHS 状态 Compliant Compliant (per Altera product page)
Speed Grade C2 -4
Series — Stratix III E
Logic Elements (LE) — 255,000
Adaptive Logic Modules (ALM) — 10,200 LABs / 10200 ALMs (per Mouser listing)
Embedded Memory (bits) — 16,672,768
User I/O Count — 976
DSP Blocks — 768 (18x18 multipliers per Mouser listing)
Ball Count — 1517
Package Style — Flip-Chip BGA
工作温度 — Commercial (0C to +85C) - inferred from C4 suffix
Process Node — 40 nm
Lead-Free — Yes

数据手册与资源

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