EP3SE260H780C4N vs EP3SE260H780C2N 对比

详细并排对比 EP3SE260H780C4N 出自 Intel 和 EP3SE260H780C2N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780C2N EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N - Stratix III E FPGA 255K LE, 780-BGA | Intel

EP3SE260H780C2N ⚠ 最后一次采购

规格对比

参数 EP3SE260H780C4N EP3SE260H780C2N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $1,395.00 $3,600.00
Family Stratix III E (Enhanced) —
Logic Elements 255,000 255,000
Logic Array Blocks (LABs) 10,200 —
Total RAM Bits 16,672,768 16,672,768
Embedded Memory M9K and M144K blocks —
User I/O Pins 488 —
DSP Blocks (18x18 Multipliers) 768 —
PLLs 12 —
Process Node 65 nm CMOS 40 nm
Core Voltage 0.86 V to 1.15 V 0.9 V
Maximum Core Clock Frequency 450 MHz —
封装 780-ball FCBGA (Flip Chip BGA) 780-BGA FCBGA
安装类型 Surface Mount Surface Mount
湿敏等级(MSL) 3 (168 hours) —
工作温度 0C to +85C (commercial) —
Configuration Method Serial/Parallel via Quartus II —
Series — Stratix III E
LABs / CLBs — 10,200
User I/O Count — 488
Number of Transceivers — [DATA_NEEDED: transceiver count]
工作温度范围 — Commercial (0C to +85C)
Speed Grade — C2
MSL 等级 — 3 (168 hours)
Reflow Peak Time Max — 40 s
RoHS 状态 — [DATA_NEEDED: rohs status]
Lead-Free — [DATA_NEEDED: lead-free]
Package Code — BGA
Terminal Form — Ball
Number of Terminals — 780

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