EP3SE260H780I4LG vs EP3SE260H780I4L 对比
详细并排对比 EP3SE260H780I4LG 出自 Intel 和 EP3SE260H780I4L 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SE260H780I4LG | EP3SE260H780I4L |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,580.00 | $1,395.00 |
| Series | Stratix III Enhanced | — |
| Family | EP3SE260 | Stratix III E (Enhanced) |
| Logic Elements | 255,000 LE | 255,000 |
| Adaptive Logic Modules (ALMs) | 102,000 ALM | — |
| Embedded Memory | 15.90 Mbit | — |
| DSP Blocks | 304 | — |
| 18x18 Multipliers | 840 | — |
| User I/O | 488 | — |
| PLLs | 8 (4 fractional + 4 general-purpose) | — |
| Speed Grade | -4 | — |
| Temperature Grade | Industrial (I) | — |
| 封装 | 780-ball FineLine BGA (HBGA) | — |
| 工作温度 | -40C to +100C | Industrial, -40C to +85C |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial | — |
| Total Memory Bits | — | 16,672,640 |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| User I/O Count | — | 488 |
| Core Voltage | — | 0.9 V |
| Package Type | — | 780-pin FC-HFBGA (flip-chip BGA) |
| 安装类型 | — | Surface Mount (flip-chip) |
| Number of Transceivers | — | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | — | 6.375 Gbps (Stratix III E family spec) |
| Number of 18x18 Multipliers | — | [DATA_NEEDED: per-package multiplier count] |
| RoHS 状态 | — | Compliant (lead-free) |
| Configuration Mode | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | — | 780-BBGA, FCBGA (flip-chip) |