EP3SE50F484C3N vs EP3SE50F484C4LN 对比

详细并排对比 EP3SE50F484C3N 出自 Intel 和 EP3SE50F484C4LN 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE50F484C3N EP3SE50F484C4LN
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $832.10 $772.12
Family Stratix III E Stratix III E
Device Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Adaptive Logic Modules (ALMs) 18,750 —
Embedded Memory (Bits) 5,760,000 —
User I/Os 296 —
Maximum Internal Frequency 717 MHz (typical); 800 MHz per DigChip —
Process Technology TSMC 40 nm low-power CMOS —
封装 484-ball FBGA (FCBGA), 1.0 mm pitch —
电源电压 Core and I/O voltages per Stratix III E datasheet —
工作温度 0C to +85 C (commercial, C suffix) 0C to +85C (commercial)
安装类型 Surface Mount (BGA) Surface Mount
MSL 等级 3 (per JEDEC J-STD-020 for FCBGA packages) —
RoHS 状态 Lead-free (per DigiKey listing) —
Configuration Mode Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG —
Design Software Intel Quartus II (Stratix III support) —
生命周期状态 Obsolete (per Worldway listing 2026-04-05) —
Logic Elements (LE) — 47,500
LABs/CLBs — 1900
Total RAM Bits — 2,344,448 (2286 Kbit)
Number of I/O — 296
Number of Multipliers (18x18) — 384
Voltage - Supply (Core) — 0.85 V to 1.1 V
Voltage - Supply (I/O) — 1.5 V / 1.8 V / 2.5 V / 3.3 V
封装 / 外壳 — 484-BBGA, FCBGA (FineLine BGA)
Lead Free / RoHS — Lead free / RoHS compliant
Process Node — 40 nm CMOS
Speed Grade — C4
Configuration — FPP / AS / JTAG

数据手册与资源

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