EP3SE50F780C3G vs EP3SE50F780C4G 对比

详细并排对比 EP3SE50F780C3G 出自 Altera 和 EP3SE50F780C4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SE50F780C3G EP3SE50F780C4G
品牌 Altera Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1,030.00 $593.00
Series Stratix III E Stratix III
Manufacturer Altera (now Intel) —
Family Stratix III E enhanced FPGA Stratix III E
Number of Logic Elements (LE) 47,500 LE —
Number of Adaptive Logic Modules (ALM) 19,000 ALM —
Embedded Memory 5.49 Mbit (5,760,000 bit) 5.76 Mbit (5760000 bit)
Number of User I/O 488 —
Number of I/O Banks [DATA_NEEDED: I/O bank count] —
Core Supply Voltage 1.1 V 1.1 V
工作温度 0C to +85C (Commercial) —
Speed Grade C3 —
封装 / 外壳 780-BBGA, FCBGA (Flip-Chip) —
安装方式 SMD/SMT —
Packaging Tray —
RoHS 状态 Compliant Compliant
生命周期状态 Not Recommended for New Designs (NRND) —
Configuration Memory External (EPCS / flash) SRAM-based (volatile, requires configuration device)
Logic Elements — 47,500 LE
Adaptive Logic Modules (ALMs) — 19,000 ALM
Number of I/Os — 488
Number of Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count from datasheet]
Number of Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Process Technology — 40 nm TSMC
工作温度范围 — 0 C to +85 C (commercial)
封装 — 780-ball FBGA (FCBGA)
安装类型 — Surface Mount (SMD/SMT)
Lead-Free — Yes
MSL 等级 — MSL3 (per JEDEC J-STD-020)
Design Software — Quartus II

数据手册与资源

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