EP3SL70F484I3 vs EP3SL50F484I3 对比
详细并排对比 EP3SL70F484I3 出自 Intel 和 EP3SL50F484I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL70F484I3 | EP3SL50F484I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,013.66 | $701.23 |
| Family | Stratix III L | Stratix III L (Low Power) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | Stratix III L — supports high-speed serial transceivers per family datasheet |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| 工作温度 | -40C to +100C (industrial) | 0 °C to +85 °C (commercial) |
| 封装 | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS 状态 | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/O | — | 296 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Internal Operating Frequency | — | 500 MHz |
| 安装类型 | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |