EP3SL70F780C4LN vs EP3SL70F780I3 对比
详细并排对比 EP3SL70F780C4LN 出自 Intel 和 EP3SL70F780I3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP3SL70F780C4LN | EP3SL70F780I3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1,380.00 | $1,096.81 |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 67,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Total RAM Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| 引脚数 | 780 | — |
| Package Type | 780-FBGA (FCBGA) | — |
| Package Dimensions | 29 x 29 mm | — |
| Process Technology | 65 nm | — |
| Core Voltage Range | 0.86 V to 1.15 V | — |
| 工作结温 | 0C to 85C (commercial) | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| MSL 等级 | 3 (per JEDEC J-STD-020) | — |
| Design Software | Quartus II (legacy Stratix III support) | — |
| Embedded Memory Bits | — | 2,699,264 bits |
| Maximum User I/O | — | 488 |
| 工作温度 | — | -40 C to +100 C (Industrial) |
| Speed Grade | — | I3 (industrial) |
| Core Voltage | — | 1.1 V |
| Process Node | — | 65 nm |
| 封装 | — | 780-ball FineLine BGA (FC-FBGA), 28x28 mm |
| Package Code | — | BGA780,28X28,40 |
| Configuration Mode | — | JTAG IEEE 1149.1, Passive Serial, Active Serial |
| Number of Terminals | — | 780 |
| Supplier Device Package | — | 780-BBGA, FCBGA |