EP3SL70F780I3 vs EP3SL70F780I3G 对比

详细并排对比 EP3SL70F780I3 出自 Intel 和 EP3SL70F780I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SL70F780I3 EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 - 67.5K Logic Elements Stratix III L FPGA | Intel

EP3SL70F780I3 ⚠ 最后一次采购

规格对比

参数 EP3SL70F780I3 EP3SL70F780I3G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,096.81 $990.00
Family Stratix III L Stratix III L
Logic Elements 67,500 —
Embedded Memory Bits 2,699,264 bits —
Maximum User I/O 488 —
工作温度 -40 C to +100 C (Industrial) -40C to +100C (Industrial)
Speed Grade I3 (industrial) 3 (Medium)
Core Voltage 1.1 V —
Process Node 65 nm —
封装 780-ball FineLine BGA (FC-FBGA), 28x28 mm 780-BBGA, FCBGA (29x29 mm)
Package Code BGA780,28X28,40 —
安装类型 Surface Mount Surface Mount
Configuration Mode JTAG IEEE 1149.1, Passive Serial, Active Serial —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Number of Terminals 780 —
Supplier Device Package 780-BBGA, FCBGA —
Logic Elements (LE) — 67,500
Adaptive Logic Modules (ALM) — 27,000 ALM
Embedded Memory — 2,699,264 bits (2.57 Mbit)
User I/Os — 488
Core Voltage (VCCINT) — 1.1 V
Process Technology — 40 nm TSMC
存储器类型 — SRAM-based, external configuration
DSP Blocks — Multipliers, count varies by die
Configuration — External (EPCS / JTAG)
Packaging — Tray

数据手册与资源

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