EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel
料号： EP4CGX50DF23C6N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $65.4 | $6,540.00 |
| 500 | $58.75 | $29,375.00 |
| 1,000 | $52.3 | $52,300.00 |
EP4CGX50DF23C6N 概述
A Cyclone IV GX FPGA is a programmable logic device that combines general-purpose fabric (look-up tables, flip-flops, routing, and block RAM) with hardened serial transceivers and PCIe IP, enabling cost-effective implementation of custom digital hardware, protocol bridges, and high-speed serial interfaces on a single chip. The Cyclone IV family sits below Cyclone V/10 in Intel's low-cost FPGA portfolio, optimized for volume production where power, density, and integrated transceivers matter more than absolute performance.
Key features of the EP4CGX50DF23C6N include 218 user I/O, dedicated hardware multipliers for DSP, 8 transceiver channels up to 3.125 Gbps, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and JTAG-based configuration. Compared with pure logic-only Cyclone IV E parts, the GX variant adds transceiver capability at the cost of slightly higher static power, which is acceptable when serial connectivity is required.
The device is fabricated on a 60 nm process node, which trades off absolute performance versus comparable 28/20 nm parts for substantially lower static and dynamic power consumption. The integrated transceivers remove the need for external PHY ICs in typical serial-link designs, reducing BOM cost and board area.
Typical applications include industrial video and image processing, low-cost PCIe endpoint cards, motor control and motor drive DSP, broadband access aggregation, broadcast video bridging, and protocol conversion cards. Designers choose Cyclone IV GX when a long-life, mature-node FPGA with built-in transceivers is needed at low unit cost.
A practical design tip is to plan the JTAG and configuration pinout early, and verify that the 484-pin FBGA routing escape supports both single-ended and differential pairs without violating skew rules.
This page synthesizes Intel distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, helping engineers select and qualify the part more efficiently.
直接替换替代料： EP4CGX50DF23C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CGX50DF23C6N （相同外形与封装尺寸） ——差异在于 Package, Embedded Memory, Process Technology, Embedded 18x18 Multipliers, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP4CGX50DF23C7N
✅ 直接替换✓ 有现货
$43.2 / 个
查看数据手册 →EP4CGX50DF23C8N
✅ 直接替换✓ 有现货
$56.4 / 个
查看数据手册 →EP4CGX50DF27C6N
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP4CGX30DF23C6N
✅ 直接替换📋 参考替代料（不在目录中）
EP4CGX110DF23I7N
✅ 直接替换✓ 有现货
$182 / 个
查看数据手册 →EP4CGX50DF23C6N 最大额定值与电气特性
| Family | Cyclone IV GX |
| Logic Elements | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 |
| Embedded Memory | 2,340 Kbits |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Number of Pins / Balls | 484 |
| Package Type | 484-ball FBGA (PBGA) |
| JEDEC Package Code | S-PBGA-B484 |
| User I/O | 218 |
| Transceiver Channels | Up to 8 |
| Maximum Transceiver Data Rate | 3.125 Gbps |
| Operating Temperature Grade | Commercial |
| 安装类型 | Surface Mount (BGA) |
| Configuration Method | JTAG / Passive Serial / Active Serial |
EP4CGX50DF23C6N s-pbga-b484 引脚配置指南
EP4CGX50DF23C6N（s-pbga-b484 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CGX50DF23C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CGX50DF23C6N 适用于 6 应用s: Industrial Ethernet Protocol Bridging, Low-Cost PCIe Endpoint Card, Broadcast Video Bridge and Router, Motor Control and Drive DSP, Wireless Baseband Aggregation, Test and Measurement Instrumentation.
Industrial Ethernet Protocol Bridging
The EP4CGX50DF23C6N's 8 high-speed transceivers at up to 3.125 Gbps and 49,888 logic elements make it ideal for industrial Ethernet bridges between PROFINET, EtherCAT, EtherNet/IP, and Modbus TCP networks. The transceiver channels handle 1000BASE-T PHY SERDES while the dense logic fabric implements protocol stacks, cycle-time scheduling, and timestamping. With 2,340 Kbits embedded RAM, frame buffers can be hosted on-chip. Its commercial 0-85C temperature grade and 484-ball FBGA package fit typical factory-floor enclosure budgets and supply requirements.
推荐
Low-Cost PCIe Endpoint Card
The EP4CGX50DF23C6N's integrated PCIe hard IP block paired with 8 transceivers enables compact PCIe Gen1 x1/x4 endpoint cards without external PHYs. With 49,888 LE the device implements typical endpoint logic, DMA engines, MSI/MSI-X handlers, and small register interfaces. The 484-ball FBGA provides ample user I/O (218) for board-level signaling, while 2,340 Kbits of block RAM buffers PCIe payloads. Designers choose this part for industrial control cards, low-cost data acquisition, and instrumentation where PCIe x1 Gen1 bandwidth suffices.
推荐
Broadcast Video Bridge and Router
The EP4CGX50DF23C6N's transceivers handle SDI, HDMI, and DisplayPort physical-layer serialization while 49,888 logic elements implement format conversion (SD/HD/3G-SDI), color-space translation, and audio embedding. Its 2,340 Kbits embedded RAM hosts line buffers, lookup tables, and audio channel memory. With 218 user I/O the FBGA-484 package accommodates parallel video buses plus control interfaces. Commercial temperature grade suits studio and broadcast truck environments.
推荐
Motor Control and Drive DSP
The EP4CGX50DF23C6N's dedicated hardware multipliers and 49,888 LE support multi-axis field-oriented control (FOC) loops, SVPWM generation, and closed-loop PID at tens of kHz per axis. The 8 transceivers connect to digital encoder buses (EnDat 2.2, BISS, HIPERFACE DSL) and backplane EtherCAT. With 2,340 Kbits embedded RAM and 218 user I/O, gate-driver signals and current-sensor ADCs interface directly. Commercial temperature rating fits most enclosed drives.
推荐
Wireless Baseband Aggregation
The EP4CGX50DF23C6N's 8 transceivers up to 3.125 Gbps enable CPRI/OBSAI fronthaul aggregation between baseband units and remote radio heads in small-cell and DAS deployments. The 49,888 LE implement IQ sample packing, framer/deframer, and timing synchronization logic; 2,340 Kbits embedded RAM buffers sub-frame data. The 484-ball FBGA is industry-standard for line-card layouts, easing PCB reuse across product variants.
推荐
Test and Measurement Instrumentation
The EP4CGX50DF23C6N's logic density, transceivers, and 218 user I/O make it ideal for mid-range bench instruments such as protocol analyzers, logic-pattern generators, and JTAG-controlled board testers. The transceivers handle high-speed serial triggers and stimulus while 49,888 LE implement capture memory, pattern matching, and triggering state machines. With 2,340 Kbits embedded RAM and a 60 nm low-power process, fanless bench-top operation is feasible at the commercial 0-85C grade.
推荐
推荐产品汇总
工程参考数据： EP4CGX50DF23C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CGX50DF23C7N | EP4CGX50DF23C8N | EP4CGX50DF27C6N | EP4CGX30DF23C6N | EP4CGX110DF23I7N |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (PBGA) | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same | 672-ball FBGA - not pin-compatible | 484-ball FBGA (PBGA) - same | 484-ball FBGA (PBGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 29,440 | 109,440 |
| Embedded Memory (Kbits) | 2,340 | 2,340 | 2,340 | 2,340 | 1,080 | 5,490 |
| Transceiver Channels | 8 (up to 3.125 Gbps) | 8 | 8 | 8 | 8 | 8 |
| User I/O | 218 | 218 | 218 | 310 | 168 | 270 |
| Process / Core Voltage | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V | 60 nm / 1.2 V |
| Temperature Grade | Commercial (0 to 85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40 to 100C) |
| Speed Grade | C6 | C7 (faster) | C8 (fastest) | C6 | C6 | I7 (industrial + faster) |
关键差异点
- Integrated 8-channel transceivers at 3.125 Gbps （对比 EP4CGX50CF23C6N)
- Higher density with same FBGA-484 footprint （对比 EP4CGX30DF23C6N)
- Mature 60 nm low-power process （对比 Lattice ECP4)
设计说明
The 484-ball FBGA package requires a 1.0 mm or 1.27 mm pitch escape routing. Use a 6-layer or 8-layer stackup with dedicated ground planes under the device to control impedance of differential transceiver pairs (typically 100 ohm differential). Reference the JEDEC S-PBGA-B484 mechanical drawing for ball pad and solder-mask dimensions; non-solder-mask-defined pads are recommended.
Estimated: with 8 transceivers active at 3.125 Gbps and ~70% logic utilization, core current draw will approach 0.8-1.2 A at 1.2 V. Use a dedicated LDO or DC-DC regulator for VCCINT with at least 20% headroom; place bulk decoupling (220 uF tantalum or polymer) and 0.1 uF + 10 nF ceramic pairs within 5 mm of every supply pin pair.
Transceiver channels require AC-coupling capacitors (0.01 uF) in series with each TX/RX pair. Route transceiver lanes with controlled 100-ohm differential impedance, keep length matching within 0.127 mm (5 mil) on a pair, and avoid crossing reference-plane splits. The Cyclone IV GX Transceiver User Guide provides reference equalization settings per data rate.
Estimated: at full transceiver and logic activity the FBGA-484 junction-to-ambient thermal resistance is approximately 15-20 C/W with 4-layer PCB and adequate copper. With 2 W typical dissipation, expect ~30-40 C junction rise above ambient. For sealed enclosures, derate transceiver data rate or use a heatsink. Industrial variants (I7) are recommended above 70C ambient.
Common pitfalls when designing with this part include: (1) confusing the 'DF23' ball pattern with 'DF27' (different ball counts); (2) using the wrong configuration mode (AS vs PS) for the boot EEPROM; (3) leaving JTAG TCK unterminated; (4) mixing LVDS and LVTTL I/O standards on the same bank without VREF planning. Verify each against the Cyclone IV Device Handbook pin connection guidelines before tape-out.
合规信息
RoHS and REACH compliance inferred from Intel/Alterac product line standards; no AEC-Q100 automotive grade for this commercial-temp part. JEDEC package code S-PBGA-B484 verified from third-party distributor listings.
