EP4SGX110HF35C2G vs EP4SGX110HF35I3G 对比
详细并排对比 EP4SGX110HF35C2G 出自 Intel 和 EP4SGX110HF35I3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX110HF35C2G | EP4SGX110HF35I3G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3,700.00 | $7,900.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 105,600 | 105,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 9,793,536 | 9,793,536 (9.4 Mbit) |
| Embedded Memory Blocks (M9K/M144K) | [DATA_NEEDED: block count] | — |
| User I/O Pins | 488 | — |
| Multi-Gigabit Transceivers | Up to 8.5 Gbps | 8 channels (3.125 Gbps to 8.5 Gbps per family datasheet) |
| Number of Transceivers | [DATA_NEEDED: channel count] | — |
| Hard Memory Controllers | [DATA_NEEDED: yes/no] | — |
| Hard PCIe Blocks | Yes (Gen1/Gen2) | — |
| DSP Blocks | [DATA_NEEDED: count] | — |
| Process Technology | 40 nm | 40 nm low-power CMOS |
| Core Voltage (VCC) | 0.9 V | — |
| 封装 | 1152-ball FC-FBGA (HF35, 35 mm body) | 1152-ball FC-FBGA (HF35), 35 x 35 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) | Surface Mount (Flip-Chip BGA) |
| Operating Temperature Grade | Commercial (C2) | — |
| RoHS 状态 | Compliant | Compliant |
| Speed Grade | 2 (core speed bin) | — |
| Maximum User I/O Pins | — | 488 |
| Multipliers (18x18) | — | 352 |
| Core Supply Voltage (nominal) | — | 0.9 V |
| Speed/Grade | — | I3 (Industrial, -3 speed) |
| 工作结温 | — | -40 C to +100 C |
| Hard IP Blocks | — | PCIe Gen1/Gen2, external memory PHY |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Lead-Free / Halogen-Free | — | Lead-free |
| Configuration Memory | — | SRAM-based (volatile, requires configuration device) |