EP4SGX230HF35I4G vs EP4SGX70DF29I4G 对比
详细并排对比 EP4SGX230HF35I4G 出自 Intel 和 EP4SGX70DF29I4G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX230HF35I4G | EP4SGX70DF29I4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $7,900.00 | $1,395.00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 72,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| 封装 | 1152-ball FCBGA (HF35) | 780-BBGA, FCBGA (29x29 mm) |
| 工作温度 | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| RoHS 状态 | Compliant | Compliant |
| 安装类型 | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Number of LABs/CLBs | — | 2,904 |
| Total RAM Bits | — | 7,564,880 |
| Number of I/O | — | 372 |
| Process Technology | — | 40 nm |
| Speed Grade | — | I4 |
| Transceivers | — | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | — | 384 (per family) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |
| Lead-Free | — | Yes |