EP4SGX70DF29I4G - Stratix IV GX 72.6K LE FPGA, 780-FBGA | Intel
料号： EP4SGX70DF29I4G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP4SGX70DF29I4G 概述
What is a Stratix IV GX FPGA? The Stratix IV GX is a high-performance, low-power 40 nm FPGA family from Intel (formerly Altera) that combines a logic fabric, embedded memory blocks (M9K/M144K), DSP blocks, and multi-gigabit transceivers (MGTs) on a single die. It sits within the broader taxonomy: FPGA -> programmable logic device -> semiconductor IC, and was engineered to displace ASICs in high-bandwidth applications such as wireline communications, broadcast video, and high-end test and measurement equipment. The EP4SGX70DF29I4G occupies the lower end of the Stratix IV GX density range, positioned between the smaller EP4SGX50/110 and the larger EP4SGX230/290/360/530 variants.
Key features include 72,600 logic elements, 7,564,880 embedded RAM bits, support for external memory interfaces (DDR/DDR2/DDR3/QDRII/RLDRAM), 384 18x18 multipliers for DSP, and PCI Express hard IP blocks. The "I" speed grade and "4" device grade designation place this part in the -40C to +100C industrial temperature range. Integrated transceivers operate up to 8.5 Gbps, enabling protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO.
Typical applications include high-speed serial interface bridging, digital signal processing for radar and software-defined radio, ASIC prototyping, high-throughput data acquisition systems, and telecom line-card implementations. The 780-FBGA (29x29 mm) flip-chip package requires careful PCB layout and controlled-impedance routing for the high-speed serial channels.
Designers should consult the Stratix IV GX handbook for transceiver channel placement rules and use Quartus II (or later) for synthesis, place-and-route, and timing closure. The exposed-die flip-chip BGA requires a thermal management strategy (heatsink or controlled airflow) for high utilization workloads.
This page synthesizes distributor pricing, drop-in-compatible Stratix IV GX variants in the same 780-FBGA package, and practical design considerations not collated in the manufacturer datasheet.
直接替换替代料： EP4SGX70DF29I4G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX70DF29I4G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Family, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP4SGX70DF29I3G
✅ 直接替换✓ 有现货
$1080 / 个
查看数据手册 →EP4SGX70DF29C4G
✅ 直接替换✓ 有现货
$196.99 / 个
查看数据手册 →EP4SGX70DF29C4N
✅ 直接替换✓ 有现货
$1750 / 个
查看数据手册 →EP4SGX110DF29I4G
✅ 直接替换✓ 有现货
$1085 / 个
查看数据手册 →EP4SGX110DF29I3G
✅ 直接替换✓ 有现货
$1995 / 个
查看数据手册 →EP4SGX230HF35I4G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$7900 / 个
查看数据手册 →EP4CGX75DF27I7N
✅ 直接替换✓ 有现货
$58.75 / 个
查看数据手册 →EP4SGX70DF29I4G 最大额定值与电气特性
| Family | Stratix IV GX |
| Logic Elements | 72,600 |
| Number of LABs/CLBs | 2,904 |
| Total RAM Bits | 7,564,880 |
| Number of I/O | 372 |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| 封装 | 780-BBGA, FCBGA (29x29 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +100C (Industrial) |
| Speed Grade | I4 |
| Transceivers | Up to 8 multi-gigabit channels (per family) |
| DSP Multipliers (18x18) | 384 (per family) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
EP4SGX70DF29I4G 780-bbga, fcbga (29x29 mm) 引脚配置指南
EP4SGX70DF29I4G（780-bbga, fcbga (29x29 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX70DF29I4G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX70DF29I4G 适用于 6 应用s: High-Speed Serial Interface Bridging, Digital Signal Processing for Radar and Software-Defined Radio, ASIC Prototyping and Emulation, High-Throughput Data Acquisition Systems, Telecom Line-Card and Baseband Processing, Broadcast Video Processing and Format Conversion.
High-Speed Serial Interface Bridging
The EP4SGX70DF29I4G integrates multi-gigabit transceivers supporting up to 8.5 Gbps, enabling PCIe Gen1/Gen2, XAUI, and Serial RapidIO bridging in telecom and networking line cards. With 72,600 logic elements and dedicated hard IP for PCI Express, the device bridges between ASIC/ASSP processors and backplanes. Placed on the line-card PCB with 100-ohm differential routing to the edge connector, it eliminates the need for an external PHY while consuming the transceiver voltage rails typical of Stratix IV GX designs.
推荐
Digital Signal Processing for Radar and Software-Defined Radio
The EP4SGX70DF29I4G's 384 18x18 DSP multipliers and high memory bandwidth make it well suited for FFT-based radar processing and SDR baseband channels. Engineers implement pipelined FIR filters, FFT cores, and digital down-converters in the 7,564,880-bit embedded memory array, achieving multi-Gsps throughput. The 0.9 V core supply limits dynamic power versus older 90 nm FPGAs, while transceivers stream ADC/DAC data to/from the host processor.
推荐
ASIC Prototyping and Emulation
With 72,600 logic elements and abundant embedded memory, the EP4SGX70DF29I4G is a classic target for ASIC and SoC prototyping of mid-complexity designs. Designers partition RTL across multiple Stratix IV GX devices, using LVDS or multi-gigabit serial links for chip-to-chip timing-accurate connections. Quartus II supports time-budget-driven synthesis and the FPGA-in-the-loop debug tooling. Compared to custom ASIC NRE, prototyping on EP4SGX70DF29I4G cuts development cost while preserving real-world timing accuracy at MHz+ clock rates.
推荐
High-Throughput Data Acquisition Systems
The EP4SGX70DF29I4G pairs easily with multi-Gsps ADCs and DACs in scientific and test equipment. Its transceivers carry JESD204B/C high-speed serial converter data, while 7.5 Mbits of embedded RAM buffer channelizer FFT outputs. Industrial temperature grade (I4, -40C to +100C) supports outdoor or laboratory instrument deployments. The 780-FBGA exposes 372 I/O for parallel LVDS or LVCMOS data acquisition paths, enabling both narrow-bandwidth parallel and high-bandwidth serial architectures on the same PCB.
推荐
Telecom Line-Card and Baseband Processing
Stratix IV GX devices including the EP4SGX70DF29I4G were widely adopted in 3G/4G base-station baseband cards, OTN/SONET framer/mapper designs, and CPRI front-haul links. The transceiver channels terminate CPRI or OBSAI at up to 6.144 Gbps while the logic fabric implements MAC-layer and PHY-layer functions. Industrial temperature grade and long-life product status make it a fit for telecom OEMs requiring 10+ year production continuity.
推荐
Broadcast Video Processing and Format Conversion
Broadcast video routers, format converters, and multi-viewer systems benefit from the EP4SGX70DF29I4G's combination of logic density and high-speed serial I/O. The FPGA implements SDI de/embedders, color-space converters, and audio de-embedders while SDI transceivers handle SD/HD/3G-SDI streams. With 372 user I/O available, the device simultaneously interfaces to HDMI, DisplayPort, or analog video ADCs/DACs alongside SDI ports. The 780-FBGA footprint simplifies routing of differential pairs for jitter-sensitive video paths.
推荐
推荐产品汇总
工程参考数据： EP4SGX70DF29I4G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX70DF29I3G | EP4SGX70DF29C4G | EP4SGX110DF29I4G | EP4SGX110DF29I3G | EP4CGX75DF27I7N |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (DF29) | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF27) - different body |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Stratix IV GX | Cyclone IV GX |
| Logic Elements | 72,600 | 72,600 | 72,600 | 110,000 | 110,000 | 74,448 |
| User I/O | 372 | 372 | 372 | 372 | 372 | 390 |
| Speed/Temp Grade | I4 (Industrial, fastest) | I3 (Industrial) | C4 (Commercial) | I4 (Industrial, fastest) | I3 (Industrial) | I7 (Industrial) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 60 nm |
| Approx. Unit Price (qty 1) | USD 1,850 | USD ~1,650 | USD ~1,400 | USD ~2,400 | USD ~2,150 | USD ~250 |
关键差异点
- Highest-speed industrial grade in 72.6K LE Stratix IV GX family （对比 EP4SGX70DF29I3G)
- Industrial temperature range with full transceiver functionality （对比 EP4SGX70DF29C4G)
- Lower-density sweet spot - no over-provisioned silicon cost （对比 EP4SGX110DF29I4G)
设计说明
The 780-FBGA flip-chip package dissipates significant power at high utilization; the Stratix IV GX handbook recommends a thermal interface material (TIM) plus heatsink for designs exceeding ~6 W total power. Use Quartus PowerPlay early in the design cycle to estimate junction temperature and validate against the 100C industrial limit.
The 29x29 mm BGA lands must follow Intel's recommended 1.0 mm pitch ball pattern with non-solder-mask-defined (NSMD) pads for reliability. Use microvia or stacked-via PCB construction; 4-6 layer stack-up is acceptable for low-density designs, but 8-10 layers are recommended when using all 8 transceiver channels. Maintain 100-ohm differential impedance on all MGT lanes.
Transceiver channel placement is constrained - consult the Stratix IV GX Device Handbook pin tables and use the Quartus Pin Planner before PCB layout. Each MGT quad has reference clock inputs that must be routed with controlled impedance; avoid splitting a quad across non-adjacent banks. Place decoupling capacitors on the bottom side of the PCB directly beneath the BGA with short vias.
Do not confuse the DF29 780-FBGA with the DF27 780-FBGA used on lower-cost Cyclone IV GX parts - both have 780 balls but different body sizes (29x29 vs 27x27 mm) and pinouts. Mixing these is a common PCB rework scenario. Verify the package code on the datasheet before committing to layout.
合规信息
RoHS and lead-free per Intel product declaration. AEC-Q100 not applicable (FPGAs are not automotive-qualified per standard). Halogen-free status not stated in available data.