EPF10K130EFC484-3 vs EPF10K130EFC484-1 对比

详细并排对比 EPF10K130EFC484-3 出自 Intel 和 EPF10K130EFC484-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K130EFC484-3 EPF10K130EFC484-1
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $178.92 $92.00
Family FLEX 10KE FLEX-10KE
Logic Elements (LEs) 6,656 —
Typical Gate Count 130,000 system gates —
Logic Array Blocks (LABs) 832 832
Embedded Memory (EABs) 16 x 4,096 bits (65,536 bits total) —
Maximum User I/O 369 —
Supply Voltage (Core) 3.3 V —
I/O Voltage Support 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) —
Propagation Delay 0.6 ns (per LE) 0.6 ns
Speed Grade -3 -1 (slower commercial bin)
工作温度 0 C to +70 C (commercial) 0C to +70C (Commercial)
封装 484-pin FBGA (FineLine BGA) —
安装类型 Surface Mount (BGA) Surface Mount
Configuration Method SRAM-based, serial or parallel, requires external configuration device —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Logic Family CMOS (SRAM-based) CMOS
Series — FLEX-10KE
Typical Gates — 130,000
Logic Elements — 6,656
Embedded Memory (EAB) — 65,536 bits (64 Kbit)
User I/Os — 369
Maximum Frequency — 333.33 MHz
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant)
Package Type — FineLine BGA-484
Package Dimensions — 23 x 23 mm
Ball Pitch — 1.0 mm
Configuration Interface — JTAG (IEEE 1149.1 / IEEE 1532)

数据手册与资源

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