EPF10K130EFC484-3 vs EPF10K130EFC484-1 비교
다음의 상세 나란히 비교: EPF10K130EFC484-3 제조: Intel 및 EPF10K130EFC484-1 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | EPF10K130EFC484-3 | EPF10K130EFC484-1 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | NRND | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $178.92 | $92.00 |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | 832 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | 0.6 ns |
| Speed Grade | -3 | -1 (slower commercial bin) |
| 동작 온도 | 0 C to +70 C (commercial) | 0C to +70C (Commercial) |
| 패키지 | 484-pin FBGA (FineLine BGA) | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | CMOS |
| Series | — | FLEX-10KE |
| Typical Gates | — | 130,000 |
| Logic Elements | — | 6,656 |
| Embedded Memory (EAB) | — | 65,536 bits (64 Kbit) |
| User I/Os | — | 369 |
| Maximum Frequency | — | 333.33 MHz |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 3.3 V (MultiVolt I/O compatible with 5.0 V tolerant) |
| Package Type | — | FineLine BGA-484 |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Interface | — | JTAG (IEEE 1149.1 / IEEE 1532) |