EPF10K130EFC484-3 vs EPF10K130EFC484-3N 对比
详细并排对比 EPF10K130EFC484-3 出自 Intel 和 EPF10K130EFC484-3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K130EFC484-3 | EPF10K130EFC484-3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $178.92 | $109.25 |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | 130000 |
| Logic Array Blocks (LABs) | 832 | — |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (faster timing bin) |
| 工作温度 | 0 C to +70 C (commercial) | — |
| 封装 | 484-pin FBGA (FineLine BGA) | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Series | — | FLEX-10KE |
| Number of Logic Elements / Cells | — | 6656 |
| Total RAM Bits | — | 65536 |
| Number of I/O | — | 369 |
| Number of LABs/CLBs | — | 832 |
| Number of Embedded Array Blocks (EABs) | — | 72 |
| Operating Temperature Grade | — | Commercial (0C to +70C) |
| Core Voltage | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS |
| Package Type | — | 484-BBGA (FineLine BGA) |
| Package Dimensions | — | 23 x 23 mm |
| Ball Pitch | — | 1.0 mm |
| Configuration Memory | — | SRAM-based (volatile, requires config device) |
| Configuration Interface | — | JTAG / PS / PPS / Altera serial |