EPF10K250EBC600-3 vs EPF10K200EBC600-2 对比
详细并排对比 EPF10K250EBC600-3 出自 Intel 和 EPF10K200EBC600-2 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EBC600-3 | EPF10K200EBC600-2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $205.00 | $198.00 |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 LEs | — |
| Typical Gates | 250,000 | — |
| Maximum User I/O | 470 | 470 pins |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | — |
| Total Embedded Memory | 24 Kbits (RAM) | — |
| PLLs (Phase-Locked Loops) | 4 | — |
| Dedicated Clock Inputs | 6 | — |
| Speed Grade | -3 | — |
| Core Supply Voltage | 3.3 V | — |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | — |
| 封装 | 600-ball FineLine BGA | — |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | 0°C to +70°C (Commercial) |
| Process Technology | SRAM-based CMOS | 0.30 µm CMOS |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Propagation Delay | — | 0.4 ns |
| 电源电压 | — | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Package Dimensions | — | 45 × 45 mm |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| 安装类型 | — | Surface Mount |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |
| RoHS 状态 | — | unknown |