EPF10K250EBC600-3 vs EPF10K200EBC600-2 Comparison
Detailed side-by-side comparison of EPF10K250EBC600-3 by Intel and EPF10K200EBC600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EBC600-3 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $198.00 |
| Family | FLEX 10KE | β |
| Logic Elements | 12,160 LEs | β |
| Typical Gates | 250,000 | β |
| Maximum User I/O | 470 | 470 pins |
| Embedded Array Blocks (EABs) | 12 (each 2 Kbits) | β |
| Total Embedded Memory | 24 Kbits (RAM) | β |
| PLLs (Phase-Locked Loops) | 4 | β |
| Dedicated Clock Inputs | 6 | β |
| Speed Grade | -3 | β |
| Core Supply Voltage | 3.3 V | β |
| I/O Supply Voltage | 3.3 V (5 V tolerant) | β |
| Package | 600-ball FineLine BGA | β |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG | β |
| Boundary Scan | IEEE 1149.1 (JTAG) | β |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0Β°C to +70Β°C (Commercial) |
| Process Technology | SRAM-based CMOS | 0.30 Β΅m CMOS |
| Series | β | FLEX-10KE |
| Logic Family | β | CMOS (SRAM-based) |
| Typical Gate Count | β | 200,000 gates |
| Logic Elements (LEs) | β | 9984 |
| Logic Array Blocks (LABs) | β | 1248 |
| Embedded Memory (EAB) | β | 98304 bits (96 Kbits) |
| Propagation Delay | β | 0.4 ns |
| Supply Voltage | β | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| I/O Standards | β | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | β | 600-ball BGA (BGA-600) |
| Package Dimensions | β | 45 Γ 45 mm |
| Ball Pitch | β | 1.27 mm |
| Package Height | β | 1.1 mm max |
| Mounting Type | β | Surface Mount |
| Configuration Method | β | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | β | Obsolete |
| RoHS Status | β | unknown |