EPF10K250EFC672-1 vs EPF10K250EFI672-3 对比

详细并排对比 EPF10K250EFC672-1 出自 Intel 和 EPF10K250EFI672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K250EFC672-1 EPF10K250EFI672-3
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $115.00 $125.00
Family FLEX 10KE FLEX 10KE
Logic Family CMOS —
Typical System Gates 250,000 —
Maximum User I/Os 470 —
Total Pins 672 —
Package Type BGA-672 —
Package Size 45 x 45 mm —
Ball Pitch 1.27 mm —
Package Shape Square —
Terminal Form Ball —
工作温度 0C to +70C (Commercial) 0 °C to 70 °C (commercial)
Propagation Delay 0.4 ns —
Programming Technology In-system, SRAM-based —
RoHS 状态 [DATA_NEEDED: RoHS status] Unknown (legacy Altera non-RoHS device)
安装类型 Surface Mount —
Configuration Interface Serial (passive/active) JTAG / ByteBlaster (EPC2/EPC8 PROM)
Speed Grade -1 —
Typical Gates — 250,000
Logic Elements — [DATA_NEEDED: exact LE count]
User I/O Pins — 470
Embedded Array Blocks (EABs) — 12
EAB Dual-Port Width — Up to 16-bit
Maximum EAB Memory — [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) — 0.4 ns (typical, -3 speed grade)
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 2.5 V / 3.3 V (multiVolt I/O)
封装 — 672-ball FineLine BGA, 1.27 mm pitch
Process Technology — CMOS, SRAM-based configuration
Design Entry — EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

数据手册与资源

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