EPF10K250EFC672-1 vs EPF10K250EFI672-3 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-1 by Intel and EPF10K250EFI672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFC672-1 | EPF10K250EFI672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Operating Temperature | 0C to +70C (Commercial) | 0 °C to 70 °C (commercial) |
| Propagation Delay | 0.4 ns | — |
| Programming Technology | In-system, SRAM-based | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Unknown (legacy Altera non-RoHS device) |
| Mounting Type | Surface Mount | — |
| Configuration Interface | Serial (passive/active) | JTAG / ByteBlaster (EPC2/EPC8 PROM) |
| Speed Grade | -1 | — |
| Typical Gates | — | 250,000 |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 |
| EAB Dual-Port Width | — | Up to 16-bit |
| Maximum EAB Memory | — | [DATA_NEEDED: bits per EAB] |
| Propagation Delay (tpd) | — | 0.4 ns (typical, -3 speed grade) |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (multiVolt I/O) |
| Package | — | 672-ball FineLine BGA, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based configuration |
| Design Entry | — | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog |