EPF10K250EFC672-3 vs EPF10K250EFI672-3 对比
详细并排对比 EPF10K250EFC672-3 出自 Intel 和 EPF10K250EFI672-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPF10K250EFC672-3 | EPF10K250EFI672-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.50 | $125.00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | FLEX 10KE |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | 470 |
| Core Supply Voltage | 2.5 V | 2.5 V |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V (multiVolt I/O) |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial (0C to +70C) | — |
| 封装 | 672-ball FineLine BGA (FC) | 672-ball FineLine BGA, 1.27 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | CMOS, SRAM-based configuration |
| 安装类型 | Surface Mount | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | Unknown (legacy Altera non-RoHS device) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Typical Gates | — | 250,000 |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Embedded Array Blocks (EABs) | — | 12 |
| EAB Dual-Port Width | — | Up to 16-bit |
| Maximum EAB Memory | — | [DATA_NEEDED: bits per EAB] |
| Propagation Delay (tpd) | — | 0.4 ns (typical, -3 speed grade) |
| Configuration Interface | — | JTAG / ByteBlaster (EPC2/EPC8 PROM) |
| 工作温度 | — | 0 °C to 70 °C (commercial) |
| Design Entry | — | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog |