EPF10K30EFC256-2N vs EPF10K30EFC256-3 对比
详细并排对比 EPF10K30EFC256-2N 出自 Intel 和 EPF10K30EFC256-3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N Obsolete
规格对比
| 参数 | EPF10K30EFC256-2N | EPF10K30EFC256-3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $48.57 | $24.60 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | 24,576 |
| Embedded Array Blocks (EABs) | 6 | — |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| 工作温度 | 0 °C to +70 °C (Commercial) | — |
| 电源电压 | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 micrometer CMOS |
| 封装 | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -3 (fastest) |
| Logic Elements / Cells | — | 1,728 |
| Logic Array Blocks (LABs) | — | 216 |
| User I/O Pins | — | 176 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Temperature Grade | — | Commercial |
| Configuration Interface | — | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |