EPF10K30EFC256-2N vs EPF10K30EFC256-3 비교
다음의 상세 나란히 비교: EPF10K30EFC256-2N 제조: Intel 및 EPF10K30EFC256-3 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K30EFC256-2N - FLEX 10KE FPGA 30K Gates 256-BGA | Intel / Altera
EPF10K30EFC256-2N Obsolete
사양 비교
| 파라미터 | EPF10K30EFC256-2N | EPF10K30EFC256-3 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $48.57 | $24.60 |
| Series | FLEX 10KE | — |
| Family | FLEX 10KE Embedded Programmable Logic Family | FLEX 10KE |
| Typical Gates | 30,000 | 30,000 |
| Logic Elements (LEs) | 1,728 | — |
| Embedded RAM Bits | 24,576 | 24,576 |
| Embedded Array Blocks (EABs) | 6 | — |
| User I/Os | 246 | — |
| Logic Cells | 1728 | — |
| Propagation Delay | 0.6 ns (per digchip listing; internal frequency 80 MHz) | — |
| Number of Logic Elements | 24576 | — |
| 동작 온도 | 0 °C to +70 °C (Commercial) | — |
| 공급 전압 | [DATA_NEEDED: core and I/O rail voltages] | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 micrometer CMOS |
| 패키지 | 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch | 256-ball FineLine BGA |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Configuration | Passive Serial / Active Serial / JTAG | — |
| Lead Free / RoHS | Non-RoHS (legacy, SnPb finish per FBGA-256 family) | — |
| Speed Grade | -2N (mid-grade, 0.6 ns) | -3 (fastest) |
| Logic Elements / Cells | — | 1,728 |
| Logic Array Blocks (LABs) | — | 216 |
| User I/O Pins | — | 176 |
| Maximum Operating Frequency | — | 200 MHz |
| Core Supply Voltage (VCCINT) | — | 2.5 V |
| I/O Supply Voltage (VCCIO) | — | 3.3 V (multi-voltage I/O standard support) |
| Temperature Grade | — | Commercial |
| Configuration Interface | — | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |