EPF10K50VFC484-3N vs EPF10K130EFC484-3N 对比

详细并排对比 EPF10K50VFC484-3N 出自 Intel 和 EPF10K130EFC484-3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF10K50VFC484-3N EPF10K130EFC484-3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $24.00 $109.25
Family FLEX-10K —
Logic Elements 2,880 —
Typical Gates 50,000 —
Total RAM Bits 40,960 65536
Embedded Array Blocks (EABs) 12 —
Logic Array Blocks (LABs) 10 —
Maximum User I/Os 291 —
Supply Voltage (VCCINT) 3.0 V to 3.6 V (3.3 V nominal) —
I/O Voltage Standards 5.0 V, 3.3 V, 2.5 V (MultiVolt) —
Internal Frequency 125 MHz —
Propagation Delay (per LE) 0.6 ns —
Process Technology 0.42 µm CMOS, SRAM-based 0.22 µm CMOS
封装 484-FBGA (23 x 23 mm, 1.27 mm pitch) —
工作温度 0 °C to +70 °C (commercial) —
Configuration Modes Passive Serial, Passive Parallel (Sync/Async), Active Serial, JTAG —
JTAG Support IEEE 1149.1 Boundary Scan —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
安装类型 Surface Mount (BGA) Surface Mount
Series — FLEX-10KE
Number of Logic Elements / Cells — 6656
Typical Gate Count — 130000
Number of I/O — 369
Number of LABs/CLBs — 832
Number of Embedded Array Blocks (EABs) — 72
Speed Grade — -3 (faster timing bin)
Operating Temperature Grade — Commercial (0C to +70C)
Core Voltage — 2.5 V
Package Type — 484-BBGA (FineLine BGA)
Package Dimensions — 23 x 23 mm
Ball Pitch — 1.0 mm
Configuration Memory — SRAM-based (volatile, requires config device)
Configuration Interface — JTAG / PS / PPS / Altera serial

数据手册与资源

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