EPF8282ATC100-3 vs EPF8282ATI100-3S 对比

详细并排对比 EPF8282ATC100-3 出自 Intel 和 EPF8282ATI100-3S 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPF8282ATC100-3 EPF8282ATI100-3S
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 不推荐新设计
库存状态 有库存 有库存
单价(USD) $10.25 $14.50
Family FLEX 8000 FLEX 8000
Logic Cells (LEs) 208 —
Usable Gates 2,500 —
Typical Gates Equivalent 12,000 —
Maximum User I/O 78 —
Number of Logic Array Blocks (LABs) 26 —
Embedded Array Blocks (EABs) 6 —
Total RAM Bits 12 Kbits [DATA_NEEDED: embedded RAM bits]
Process Technology 0.42 micron CMOS SRAM CMOS
Supply Voltage (Core) 5 V —
MultiVolt I/O Support 3.3 V / 5 V —
Maximum Frequency 125 MHz —
Speed Grade -3 -3
封装 100-pin TQFP (100-TQFP) —
Configuration Method SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor —
Operating Temperature (Commercial) 0 C to +70 C —
In-Circuit Reconfigurable Yes (ICR) —
Boundary Scan JTAG IEEE 1149.1 IEEE 1149.1 (JTAG)
Device Logic Elements / Cells — 208
Number of LABs/CLBs — 26
Number of Logic Elements / Cells — 208
Number of I/O — 78
Number of Gates — 2500
Voltage - Supply — 5 V
工作温度 — -40C to +85C (industrial, I grade)
安装类型 — Surface Mount
封装 / 外壳 — 100-TQFP
Supplier Device Package — 100-TQFP
Maximum Toggle Frequency — 125 MHz
Architecture — SRAM-based, in-circuit reconfigurable (ICR)
RoHS 状态 — [DATA_NEEDED: RoHS compliance status]

数据手册与资源

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