EPF8282ATC100-3 vs EPF8282ATI100-3S Comparison
Detailed side-by-side comparison of EPF8282ATC100-3 by Intel and EPF8282ATI100-3S by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF8282ATI100-3S - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel / Altera
EPF8282ATI100-3S NrndSpecification Comparison
| Parameter | EPF8282ATC100-3 | EPF8282ATI100-3S |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | FLEX 8000 | FLEX 8000 |
| Logic Cells (LEs) | 208 | — |
| Usable Gates | 2,500 | — |
| Typical Gates Equivalent | 12,000 | — |
| Maximum User I/O | 78 | — |
| Number of Logic Array Blocks (LABs) | 26 | — |
| Embedded Array Blocks (EABs) | 6 | — |
| Total RAM Bits | 12 Kbits | [DATA_NEEDED: embedded RAM bits] |
| Process Technology | 0.42 micron CMOS SRAM | CMOS |
| Supply Voltage (Core) | 5 V | — |
| MultiVolt I/O Support | 3.3 V / 5 V | — |
| Maximum Frequency | 125 MHz | — |
| Speed Grade | -3 | -3 |
| Package | 100-pin TQFP (100-TQFP) | — |
| Configuration Method | SRAM, EPC1/EPC1064/EPC1213/EPC1441, microprocessor | — |
| Operating Temperature (Commercial) | 0 C to +70 C | — |
| In-Circuit Reconfigurable | Yes (ICR) | — |
| Boundary Scan | JTAG IEEE 1149.1 | IEEE 1149.1 (JTAG) |
| Device Logic Elements / Cells | — | 208 |
| Number of LABs/CLBs | — | 26 |
| Number of Logic Elements / Cells | — | 208 |
| Number of I/O | — | 78 |
| Number of Gates | — | 2500 |
| Voltage - Supply | — | 5 V |
| Operating Temperature | — | -40C to +85C (industrial, I grade) |
| Mounting Type | — | Surface Mount |
| Package / Case | — | 100-TQFP |
| Supplier Device Package | — | 100-TQFP |
| Maximum Toggle Frequency | — | 125 MHz |
| Architecture | — | SRAM-based, in-circuit reconfigurable (ICR) |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance status] |