EPM2210GF324C4N vs EPM2210GF324C5N 对比

详细并排对比 EPM2210GF324C4N 出自 Intel 和 EPM2210GF324C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EPM2210GF324C4N EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel

EPM2210GF324C4N ✓ 量产中

规格对比

参数 EPM2210GF324C4N EPM2210GF324C5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $25.60 $17.90
Family MAX II MAX II G
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements 2,210 2210
Equivalent Macrocells 1,700 1700
User I/Os (max) 272 —
User Flash Memory (UFM) 8 Kbits 8 Kbits
Supply Voltage - Core (VCCINT) 1.8 V —
MultiVolt I/O Support 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V —
Maximum Internal Frequency 247.5 MHz —
Pin-to-Pin Logic Delay (tPD) 7.0 ns (C4 speed grade) —
Process Technology 0.18 µm 6-layer-metal flash —
封装 324-ball FineLine BGA (GF324) 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch
Programming Interface IEEE 1149.1 JTAG (ISP) —
Operating Temperature (commercial) 0 °C to +85 °C —
RoHS 状态 Compliant Compliant
Series — MAX II
Maximum User I/O — 212
Pin-to-Pin Delay (tPD) — 11.2 ns
Propagation Delay — 11.2 ns (max)
Technology — Flash CMOS, 6-layer metal
Core Voltage — 3.3 V / 2.5 V (internal)
I/O Standards — 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt)
工作温度 — 0 °C to +85 °C (commercial)
安装类型 — Surface Mount
Programmability — In-system (JTAG / IEEE 1532), non-volatile
Lead Free — Yes
MSL 等级 — 3

数据手册与资源

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