EPM2210GF324C4N vs EPM2210GF324C5N Comparison
Detailed side-by-side comparison of EPM2210GF324C4N by Intel and EPM2210GF324C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM2210GF324C4N | EPM2210GF324C5N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.60 | $17.90 |
| Family | MAX II | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) | β |
| Logic Elements | 2,210 | 2210 |
| Equivalent Macrocells | 1,700 | 1700 |
| User I/Os (max) | 272 | β |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | β |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | β |
| Maximum Internal Frequency | 247.5 MHz | β |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | β |
| Process Technology | 0.18 Β΅m 6-layer-metal flash | β |
| Package | 324-ball FineLine BGA (GF324) | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | β |
| Operating Temperature (commercial) | 0 Β°C to +85 Β°C | β |
| RoHS Status | Compliant | Compliant |
| Series | β | MAX II |
| Maximum User I/O | β | 212 |
| Pin-to-Pin Delay (tPD) | β | 11.2 ns |
| Propagation Delay | β | 11.2 ns (max) |
| Technology | β | Flash CMOS, 6-layer metal |
| Core Voltage | β | 3.3 V / 2.5 V (internal) |
| I/O Standards | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Operating Temperature | β | 0 Β°C to +85 Β°C (commercial) |
| Mounting Type | β | Surface Mount |
| Programmability | β | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | β | Yes |
| MSL Level | β | 3 |