EPM2210GF324C5N vs EPM2210GF324C5 对比
详细并排对比 EPM2210GF324C5N 出自 Intel 和 EPM2210GF324C5 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM2210GF324C5N | EPM2210GF324C5 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $17.90 | $13.60 |
| Family | MAX II G | MAX II |
| Series | MAX II | — |
| Logic Elements | 2210 | — |
| Equivalent Macrocells | 1700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/O | 212 | — |
| Pin-to-Pin Delay (tPD) | 11.2 ns | — |
| Propagation Delay | 11.2 ns (max) | — |
| Technology | Flash CMOS, 6-layer metal | — |
| Core Voltage | 3.3 V / 2.5 V (internal) | — |
| I/O Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) | — |
| 封装 | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm |
| 工作温度 | 0 °C to +85 °C (commercial) | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Programmability | In-system (JTAG / IEEE 1532), non-volatile | — |
| Lead Free | Yes | — |
| RoHS 状态 | Compliant | Compliant (lead-free) |
| MSL 等级 | 3 | — |
| Device Name | — | EPM2210 |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 5 ns (C5 speed grade) |
| Internal Performance | — | 304 MHz |
| Core Voltage (VCCINT) | — | 1.8 V |
| I/O Voltage (VCCIO) - MultiVolt | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 6-layer-metal flash, 0.18 um |
| 工作结温 | — | 0C to +85C (commercial) |
| In-System Programmability | — | JTAG (IEEE 1149.1) |