EPM570F256C3N vs EPM570F256C3 对比
详细并排对比 EPM570F256C3N 出自 Intel 和 EPM570F256C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570F256C3N | EPM570F256C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $13.75 | $14.85 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User Flash Memory (UFM) | 8 Kbits | — |
| Maximum Operating Frequency | 304 MHz | 304 MHz |
| Process Technology | 0.18 um, 6-layer-metal flash CMOS | 0.18 µm |
| Core Voltage | 2.5 V / 3.3 V | — |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V | — |
| 封装 | 256-ball FBGA (FineLine BGA) | 256-FBGA (FineLine BGA) 17 × 17 mm |
| User I/O Count | [DATA_NEEDED: confirm exact user-IO count for F256 package] | 80 (max for F256 package) |
| Operating Temperature (C3 grade) | 0 C to +85 C (commercial) | — |
| Programming Interface | JTAG (IEEE 1532 / IEEE 1149.1) + ISP | JTAG (IEEE 1149.1) - ISP |
| 安装类型 | Surface Mount | Surface Mount |
| MSL 等级 | [DATA_NEEDED: MSL level not stated in provided data] | — |
| RoHS 状态 | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes (per suffix 'N' convention) | Yes |
| Typical Macroscopic Functions | Glue logic, bus bridging, I/O expansion, power sequencing | — |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements / Macro Cells | — | 440 Logic Elements (~570 macro cells equivalent) |
| Propagation Delay (tPD) | — | [DATA_NEEDED: tPD in ns] |
| User Flash Memory | — | 8 Kbits |
| Supply Voltage - Core | — | 2.5 V / 3.3 V (MultiVolt core) |
| Supply Voltage - I/O | — | 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O) |
| Configuration Memory | — | Non-volatile on-chip flash |
| 工作温度 | — | Commercial: 0 °C to +85 °C (C3 grade) |
| Design Software | — | Quartus II / Quartus Prime (legacy support) |