EPM570F256C3N vs EPM570F256C3 Vergleich

Detaillierter Direktvergleich von EPM570F256C3N von Intel und EPM570F256C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPM570F256C3N EPM570F256C3
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $13,75 $14,85
Family MAX II MAX II
Logic Elements (LEs) 570 —
Equivalent Macrocells 440 —
User Flash Memory (UFM) 8 Kbits —
Maximum Operating Frequency 304 MHz 304 MHz
Process Technology 0.18 um, 6-layer-metal flash CMOS 0.18 µm
Core Voltage 2.5 V / 3.3 V —
I/O Voltage Support (MultiVolt) 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Gehäuse 256-ball FBGA (FineLine BGA) 256-FBGA (FineLine BGA) 17 × 17 mm
User I/O Count [DATA_NEEDED: confirm exact user-IO count for F256 package] 80 (max for F256 package)
Operating Temperature (C3 grade) 0 C to +85 C (commercial) —
Programming Interface JTAG (IEEE 1532 / IEEE 1149.1) + ISP JTAG (IEEE 1149.1) - ISP
Montageart Surface Mount Surface Mount
MSL-Level [DATA_NEEDED: MSL level not stated in provided data] —
RoHS-Status Compliant (per DigiKey listing) Compliant
Lead-Free Yes (per suffix 'N' convention) Yes
Typical Macroscopic Functions Glue logic, bus bridging, I/O expansion, power sequencing —
Device Type — CPLD (Complex Programmable Logic Device)
Logic Elements / Macro Cells — 440 Logic Elements (~570 macro cells equivalent)
Propagation Delay (tPD) — [DATA_NEEDED: tPD in ns]
User Flash Memory — 8 Kbits
Supply Voltage - Core — 2.5 V / 3.3 V (MultiVolt core)
Supply Voltage - I/O — 1.8 V / 2.5 V / 3.3 V (MultiVolt I/O)
Configuration Memory — Non-volatile on-chip flash
Betriebstemperatur — Commercial: 0 °C to +85 °C (C3 grade)
Design Software — Quartus II / Quartus Prime (legacy support)

Datenblätter & Ressourcen

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