EPM570ZF256C7N vs EPM570F256C3N 对比
详细并排对比 EPM570ZF256C7N 出自 Intel 和 EPM570F256C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EPM570ZF256C7N | EPM570F256C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $17.85 | $13.75 |
| Series | MAX II | — |
| Programmable Type | In System Programmable | — |
| Macro Cells | 440 | — |
| Logic Elements (LE) | 440 | — |
| Embedded Flash Memory | 8 Kbit | — |
| Pin-to-Pin Logic Delay (tPD) | 9 ns | — |
| Maximum Operating Frequency | 201 MHz (internal) | 304 MHz |
| Maximum User I/O Pins | 160 | — |
| Supply Voltage - Internal (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Bank Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Supplier Device Package | 256-MBGA (11x11 mm) | — |
| Package Type Code | 256-FBGA / 256-TFBGA | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 0.18 µm flash-based CMOS | 0.18 um, 6-layer-metal flash CMOS |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| 工作温度范围 | 0 °C to +85 °C (commercial, suffix 'C') | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant | Compliant (per DigiKey listing) |
| Lead-Free Status | Lead free | — |
| Family | — | MAX II |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| 封装 | — | 256-ball FBGA (FineLine BGA) |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| MSL 等级 | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |