H5ANAG8NBJR-RDC vs H5AN8G8NCJR-XNC 对比
详细并排对比 H5ANAG8NBJR-RDC 出自 SK hynix 和 H5AN8G8NCJR-XNC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | H5ANAG8NBJR-RDC | H5AN8G8NCJR-XNC |
|---|---|---|
| 品牌 | SK hynix | SK hynix |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.55 | $30.69 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | — |
| 存储组织 | 2G x 8 | 1 Gb x 8 |
| Supply Voltage (VDD) | 1.2 V | — |
| I/O Voltage (VDDQ) | 1.2 V | — |
| 接口 | SSTL12 | DDR4 (8-bit data interface) |
| Speed Grade (suffix R) | DDR4-2666 class | — |
| 封装 | 78-ball FBGA | 78-ball FBGA, 7.5 mm x 11 mm |
| 安装类型 | Surface Mount | Surface Mount |
| Refresh | Self-refresh and auto-refresh (8K/64ms class per family datasheet) | Auto self-refresh |
| Bank Groups | 4 (per 16Gb DDR4 family datasheet) | — |
| Data Strobe | DQS with read/write training | — |
| Data Bus Inversion | Supported (DBI) | — |
| CAS 延迟 | [DATA_NEEDED: CAS Latency] | — |
| 工作温度 | [DATA_NEEDED: Operating Temperature Range] | 0 C to +85 C |
| RoHS 状态 | Compliant (lead-free PBGA per family product data) | Compliant |
| 生命周期状态 | Active | — |
| 存储容量 | — | 8 Gbit |
| 数据速率 | — | 3200 Mbps (DDR4-3200) |
| Clock Frequency | — | 1.6 GHz |
| 电源电压 | — | 1.14 V to 1.26 V (1.2 V nominal) |
| Architecture | — | Bank-group based DDR4 |
| Precharge | — | Auto precharge |
| On-Chip Termination | — | Dynamic ODT |
| Calibration | — | ZQ calibration, write leveling |
| Error Handling | — | CRC function |
| Reset | — | Asynchronous reset |
| Data Mask | — | Data mask function |
| Current - Operating | — | 39 mA |
| Current - Standby | — | 30 mA |
| Lead-Free / Halogen-Free | — | Yes |