H5TC4G63AFR-PBA vs K4B4G1646E-BMK0 对比

详细并排对比 H5TC4G63AFR-PBA 出自 SK hynix 和 K4B4G1646E-BMK0 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

SK hynix
H5TC4G63AFR-PBA H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA - 4Gb DDR3L SDRAM 256Mx16 | SK hynix

H5TC4G63AFR-PBA ✓ 量产中
Samsung Electronics
K4B4G1646E-BMK0 K4B4G1646E-BMK0 - 4Gb DDR3L SDRAM 1600Mbps | Samsung

K4B4G1646E-BMK0 - 4Gb DDR3L SDRAM 1600Mbps | Samsung

K4B4G1646E-BMK0 ✓ 量产中

规格对比

参数 H5TC4G63AFR-PBA K4B4G1646E-BMK0
品牌 SK hynix Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.98 $6.50
存储器类型 DDR3L SDRAM DDR3L SDRAM
Density 4Gb 4 Gb
存储组织 256M x 16 256M x 16
Supply Voltage (VDD/VDDQ) 1.35V —
数据速率 1866 Mbps (PC3L-14900) 1600 Mbps
封装 96-ball FBGA 96-FBGA
Ball Pitch 0.8mm —
Number of Banks 8 —
Burst Length 8 and 4 (with burst chop) —
CAS Latency (CL) 11, 12, 13 —
工作温度范围 0°C to +95°C (Tcase) —
接口 16-bit I/O Parallel
On-Die Termination (ODT) Yes —
ZQ Calibration Yes Yes
Write Leveling Yes —
Auto Self-Refresh Yes —
Partial Array Self-Refresh Yes —
RoHS Compliant —
Speed Grade — 1600 Mbps
Voltage — 1.35 V
工作温度 — -40°C to +95°C
Clock Frequency — 800 MHz
安装类型 — Surface Mount
Auto Precharge — Yes
Asynchronous Reset — Yes
Dynamic ODT — Yes
Data Mask — Yes

数据手册与资源

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