K3LK8L80CM-MGCT vs K3K8K80BM-JGCT 对比
详细并排对比 K3LK8L80CM-MGCT 出自 Samsung Electronics 和 K3K8K80BM-JGCT 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Samsung Electronics
K3K8K80BM-JGCT - Samsung LPDDR DRAM Memory IC | Samsung Electronics
K3K8K80BM-JGCT ✓ 量产中规格对比
| 参数 | K3LK8L80CM-MGCT | K3K8K80BM-JGCT |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $3.10 |
| 存储器类型 | LPDDR5X SDRAM | Low Power DRAM (LPDDR) component |
| Density | 32 Gbit (4 GB) | [DATA_NEEDED: die density in Gb] |
| 存储组织 | x32 | [DATA_NEEDED: x8/x16 organization] |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封装 | FBGA-315 (315-ball) | — |
| 工作温度 | -25C to +85C | [DATA_NEEDED: operating temperature range] |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 接口 | LPDDR5X (JEDEC low-power DDR) | [DATA_NEEDED: LPDDR4X or LPDDR5] |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 状态 | Compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS compliance] |
| Speed Grade Suffix | CM-MGCT | J (per Samsung speed-grade coding) |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: moisture sensitivity level] |
| Manufacturer | — | Samsung Electronics |
| Product Family | — | K3K mobile DRAM (LPDDR) component series |
| Maximum Data Rate | — | [DATA_NEEDED: Mbps] |
| Supply Voltage (VDD) | — | [DATA_NEEDED: core supply voltage] |
| Supply Voltage (VDDQ) | — | [DATA_NEEDED: I/O supply voltage] |
| Package Type | — | FBGA (Ball Grid Array) |
| Ball Count | — | [DATA_NEEDED: package ball count] |
| Packing Suffix | — | CT (per Samsung packing-code convention) |