K3LK8L80CM-MGCT vs K3LKBKB0BM-MGCP 对比
详细并排对比 K3LK8L80CM-MGCT 出自 Samsung Electronics 和 K3LKBKB0BM-MGCP 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K3LK8L80CM-MGCT | K3LKBKB0BM-MGCP |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $46.62 |
| 存储器类型 | LPDDR5X SDRAM | DRAM (LPDDR5 SDRAM) |
| Density | 32 Gbit (4 GB) | — |
| 存储组织 | x32 | 1G x 32 |
| Max Data Rate | 7500 Mbps | — |
| Supply Voltages | 0.5 V, 900 mV, 1.05 V, 1.8 V (multi-rail) | — |
| 封装 | FBGA-315 (315-ball) | FBGA-315 |
| 工作温度 | -25C to +85C | -25C to +85C |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| 接口 | LPDDR5X (JEDEC low-power DDR) | LPDDR5 x32 |
| Power Efficiency | ~25% improvement vs LPDDR5 | — |
| Application Class | Mobile, PC, automotive, on-device AI | — |
| RoHS 状态 | Compliant (per JLCPCB listing) | Compliant |
| Speed Grade Suffix | CM-MGCT | — |
| Package Family | FBGA -> BGA -> surface mount | — |
| Typical End Products | Smartphones, tablets, edge AI devices | — |
| Refresh / Standby Modes | Self-refresh, deep power-down (per LPDDR5X protocol) | — |
| MSL 等级 | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level] |
| 存储容量 | — | 32 Gbit |
| 数据速率 | — | 6400 Mbps per pin |
| Supply Voltage Rails | — | 500 mV, 900 mV, 1.05 V, 1.8 V |
| Technology Generation | — | LPDDR5 (JEDEC LPDDR5 family) |
| Density per Package | — | 4 GB (32 Gbit) |
| Refresh | — | Self-refresh and auto-refresh (LPDDR5 standard) |
| Application Segment | — | Mobile, embedded, industrial computing |
| Standby / Deep Sleep | — | LPDDR5 deep-sleep power states |
| Access Time / Latency | — | [DATA_NEEDED: CAS latency] |