K4A8G085WB-BIWE vs K4A8G085WB-BCTD 对比
详细并排对比 K4A8G085WB-BIWE 出自 Samsung Electronics 和 K4A8G085WB-BCTD 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G085WB-BIWE | K4A8G085WB-BCTD |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.50 | $7.50 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| 存储容量 | 8 Gb | 8 Gb (1G x 8) |
| Memory Organization | 1G x 8 | — |
| 数据速率 | 3200 Mbps | 3200 Mbps (PC4-25600) |
| 电源电压 | 1.2 V | 1.2 V |
| 工作温度 | 0°C to +85°C | 0°C to +95°C (TC) |
| 封装 | 78-FBGA | FBGA-78 (TFBGA) |
| 安装类型 | Surface Mount | — |
| Memory Interface | Parallel | — |
| Access Time | [DATA_NEEDED: tRCD, tRP, tRAS] | — |
| CAS 延迟 | [DATA_NEEDED: CL value] | — |
| Refresh | Auto-refresh, self-refresh | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | — |
| 无卤 | Yes | — |
| Speed Bin | — | CL22-22-22 |
| Burst Length | — | 8 (BL8) |
| On-Die Termination | — | Yes (ODT) |
| ZQ Calibration | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| JESD-30 Code | — | R-PBGA-B78 |
| Number of Terminals | — | 78 |