K4A8G085WC-BCPB vs K4A8G085WB-BCTD 对比
详细并排对比 K4A8G085WC-BCPB 出自 Samsung Electronics 和 K4A8G085WB-BCTD 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4A8G085WC-BCPB | K4A8G085WB-BCTD |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | DRAM | Memory ICs |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2.95 | $7.50 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | — |
| 存储组织 | 1G x 8 | — |
| 数据速率 | 2133 Mbps | 3200 Mbps (PC4-25600) |
| 电源电压 | 1.2 V | 1.2 V |
| 工作温度 | 0 C to +85 C | 0°C to +95°C (TC) |
| 封装 | 78FBGA | FBGA-78 (TFBGA) |
| Number of Terminals | 78 | 78 |
| Maximum Seated Height | 1.2 mm | — |
| 安装类型 | Surface Mount | — |
| Speed Grade | DDR4-2133 | — |
| 特性 | Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x] | — |
| CAS 延迟 | [DATA_NEEDED: CAS latency] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | Compliant |
| Die Revision | [DATA_NEEDED: die revision] | — |
| Standard Package Quantity | [DATA_NEEDED: standard package quantity] | — |
| 存储容量 | — | 8 Gb (1G x 8) |
| Speed Bin | — | CL22-22-22 |
| Burst Length | — | 8 (BL8) |
| On-Die Termination | — | Yes (ODT) |
| ZQ Calibration | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| CRC Function | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Data Mask Function | — | Yes |
| JESD-30 Code | — | R-PBGA-B78 |