K4A8G085WC-BCPB vs K4A8G085WC-BCTD 对比

详细并排对比 K4A8G085WC-BCPB 出自 Samsung Electronics 和 K4A8G085WC-BCTD 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A8G085WC-BCPB K4A8G085WC-BCPB - 8Gb DDR4 SDRAM 2133Mbps 1.2V | Samsung

K4A8G085WC-BCPB - 8Gb DDR4 SDRAM 2133Mbps 1.2V | Samsung

K4A8G085WC-BCPB ✗ 停产
Samsung Electronics
K4A8G085WC-BCTD K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD - 8Gb DDR4 SDRAM 2666Mbps 1.2V | Samsung

K4A8G085WC-BCTD ⚠ 最后一次采购

规格对比

参数 K4A8G085WC-BCPB K4A8G085WC-BCTD
品牌 Samsung Electronics Samsung Electronics
分类 DRAM Memory ICs
生命周期状态 停产 最后采购期
库存状态 有库存 有库存
单价(USD) $2.95 $50.85
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb 8 Gb
存储组织 1G x 8 1G x 8
数据速率 2133 Mbps 2666 Mbps (PC4-2133)
电源电压 1.2 V —
工作温度 0 C to +85 C 0C to +95C
封装 78FBGA 78-ball FBGA (78FBGA)
Number of Terminals 78 —
Maximum Seated Height 1.2 mm —
安装类型 Surface Mount Surface Mount
Speed Grade DDR4-2133 —
特性 Auto precharge, asynchronous reset, CRC, ZQ calibration, dynamic ODT, data mask —
Refresh [DATA_NEEDED: refresh rate 1x/2x] —
CAS 延迟 [DATA_NEEDED: CAS latency] —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Die Revision [DATA_NEEDED: die revision] —
Standard Package Quantity [DATA_NEEDED: standard package quantity] —
Supply Voltage (VDD/VDDQ) — 1.2 V (1.14 V to 1.26 V)
Ball Pitch — 0.8 mm
Standard Operating Temp Range — 0C to +85C
Burst Length — 8 (chop 4)
Auto Precharge — Yes
Asynchronous Reset — Yes
CRC Function — Yes
ZQ Calibration — Yes
Dynamic ODT — Yes
Data Mask — Yes
接口类型 — Synchronous, parallel

数据手册与资源

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