K4A8G085WC-BCWE vs MT40A1G8AG-062E 对比

详细并排对比 K4A8G085WC-BCWE 出自 Samsung Electronics 和 MT40A1G8AG-062E 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K4A8G085WC-BCWE K4A8G085WC-BCWE - 8Gb DDR4-3200 DRAM 1.2V | Samsung

K4A8G085WC-BCWE - 8Gb DDR4-3200 DRAM 1.2V | Samsung

K4A8G085WC-BCWE ✓ 量产中
Micron Technology
MT40A1G8AG-062E MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E - 8Gb DDR4 SDRAM 3200Mb/s x8 | Micron

MT40A1G8AG-062E ✓ 量产中

规格对比

参数 K4A8G085WC-BCWE MT40A1G8AG-062E
品牌 Samsung Electronics Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $7.38 $3.10
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 8 Gb —
存储组织 1G x 8 1G x 8
数据速率 3200 Mbps (DDR4-3200) —
电源电压 1.2 V —
工作温度 0C to +85C —
封装 78FBGA 78-FBGA (7.5 x 11 mm)
安装类型 Surface Mount Surface Mount (BGA)
接口 DDR4 (parallel, double data rate) Parallel
Application Class Computing / Embedded main memory —
Manufacturer Samsung Electronics —
Bank Group Architecture DDR4 bank groups (8n prefetch) Yes (DDR4 bank groups)
Speed Bin Suffix -BCWE (DDR4-3200, commercial temp) —
RoHS 状态 Compliant (per JLCPCB listing) [DATA_NEEDED: RoHS status]
Refresh Standard DDR4 refresh mechanisms —
On-Die Termination Yes (DDR4 ODT) —
存储容量 — 8 Gbit
Clock Frequency — 1.6 GHz (DDR4-3200, 3200 MT/s data rate)
Clock Cycle Time — 19 ns class (-062E speed grade)
Supply Voltage (VDD) — 1.2 V
Temperature Grade — Automotive (AUT)
Access Time (CAS Latency class) — DDR4-3200 timing class (tAA per datasheet)
Termination — On-Die Termination (ODT)
CA Parity — Supported (DDR4 command/address parity)
Packaging Option — Tape and Reel (TR / :R suffix)
工作温度范围 — [DATA_NEEDED: operating temperature range]
Refresh Rate — [DATA_NEEDED: refresh rate]

数据手册与资源

浏览全部产品 创建 BOM 获取报价