K4AAG085WA-BCTD vs K4AAG085WM-BCRC 对比
详细并排对比 K4AAG085WA-BCTD 出自 Samsung Electronics 和 K4AAG085WM-BCRC 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4AAG085WA-BCTD | K4AAG085WM-BCRC |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.18 | $1.00 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit (2 GB) | [DATA_NEEDED: exact density in Gb] |
| 存储组织 | 2G x 8 | x8 |
| 数据速率 | 2666 Mbps | — |
| 电源电压 | 1.2 V | — |
| 封装 | 78-ball FBGA (78FBGA) | 78-ball FBGA |
| 工作温度 | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| Speed Grade | DDR4-2666 (-BCTD) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | DDR4 parallel, JEDEC DDR4 ballout | SSTL12 |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Bank Architecture | 16 banks in 4 bank groups (DDR4 standard) | — |
| Burst Length | BL8 (DDR4 standard) | — |
| Application Domain | Computing, networking, industrial memory | — |
| Manufacturing Standard | JEDEC DDR4 SDRAM | — |
| Lead Time / Stock | [DATA_NEEDED: current stock status] | — |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Max Data Rate | — | Up to 3200 Mbps/pin (family max per Samsung DDR4 page) |
| Architecture | — | Bank-group DDR4 |
| Termination | — | On-Die Termination (ODT) |
| CAS 延迟 | — | [DATA_NEEDED: CL of -BCRC speed grade] |
| Clock | — | Differential clock CK/CK# |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |