K4AAG085WA-BCTD vs K4AAG085WM-BCWE 对比
详细并排对比 K4AAG085WA-BCTD 出自 Samsung Electronics 和 K4AAG085WM-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K4AAG085WA-BCTD | K4AAG085WM-BCWE |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | DRAM |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.18 | $7.00 |
| 存储器类型 | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit (2 GB) | 16 Gb |
| 存储组织 | 2G x 8 | 2G x 8 |
| 数据速率 | 2666 Mbps | 3200 Mbps (DDR4-3200) |
| 电源电压 | 1.2 V | 1.2 V |
| 封装 | 78-ball FBGA (78FBGA) | 78FBGA |
| 工作温度 | 0C to +85C | 0C to +85C |
| Speed Grade | DDR4-2666 (-BCTD) | — |
| 安装类型 | Surface Mount | Surface Mount |
| 接口 | DDR4 parallel, JEDEC DDR4 ballout | DDR4 (JEDEC-standard) |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status] |
| Bank Architecture | 16 banks in 4 bank groups (DDR4 standard) | — |
| Burst Length | BL8 (DDR4 standard) | — |
| Application Domain | Computing, networking, industrial memory | — |
| Manufacturing Standard | JEDEC DDR4 SDRAM | — |
| Lead Time / Stock | [DATA_NEEDED: current stock status] | — |
| Bank Group Architecture | — | Yes (DDR4) |
| Speed Grade Suffix | — | -BCWE |
| Application Class | — | Memory IC / Storage Component |
| Power Reduction vs DDR3 | — | Approx. 25% lower (per Samsung DDR4 literature) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |