K9F2808UOC-PCB0 vs K9F1G08U0B-PCB0 对比

详细并排对比 K9F2808UOC-PCB0 出自 Samsung Electronics 和 K9F1G08U0B-PCB0 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9F2808UOC-PCB0 K9F2808UOC-PCB0 - 16M x 8 NAND Flash, 48-TSOP I | Samsung

K9F2808UOC-PCB0 - 16M x 8 NAND Flash, 48-TSOP I | Samsung

K9F2808UOC-PCB0 Nrnd
Samsung Electronics
K9F1G08U0B-PCB0 K9F1G08U0B-PCB0 - 1Gbit SLC NAND Flash 3.3V 48-TSOP | Samsung

K9F1G08U0B-PCB0 - 1Gbit SLC NAND Flash 3.3V 48-TSOP | Samsung

K9F1G08U0B-PCB0 ✓ 量产中

规格对比

参数 K9F2808UOC-PCB0 K9F1G08U0B-PCB0
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1.68 $2.70
存储器类型 NAND Flash (SLC, Small-Page) SLC NAND Flash (Non-Volatile)
Memory Density 128 Mbit (16M x 8) —
存储组织 16M x 8 bit —
Operating Voltage (VCC) 2.7 V to 3.6 V —
Read Access Time 50 ns —
Page Size 528 bytes (512 main + 16 spare) 2 Kbyte + 64 byte spare
Block Size 16 pages (16 KiB + 256 spare bytes) 128 Kbyte + 4 Kbyte spare
Package Options 48-TSOP I, 48-WSOP1, 63-TBGA —
I/O Bus Width x8 —
工作温度 Commercial / Industrial (C, I grade) 0C to +70C (commercial grade)
Command Set Standard NAND (00h/01h/10h/30h/60h/D0h/50h) —
Status Output R/B# open-drain ready/busy —
Technology Node Samsung 2nd-generation SLC NAND —
Cell Type Single-Level Cell (SLC) —
Programming Model Page program, block erase —
Lead-Free / RoHS [DATA_NEEDED: RoHS status from Samsung datasheet] —
Density — 1 Gbit (128 M x 8 bit) + 32 Mbit spare
Supply Voltage (VCC) — 2.7 V to 3.6 V (3.3 V typical)
接口 — 8-bit parallel (multiplexed address/data/command)
Page Program Time (typ) — 300 us (max 700 us)
Block Erase Time (typ) — 2 ms (max 3 ms)
Endurance — 100 K program/erase cycles per block
Data Retention — 10 years
封装 — 48-pin TSOP-I (Type I), 0.5 mm pitch
安装类型 — Surface Mount
Package Material — Molded plastic (high-quality thermal grade)
Access Time — 25 us (max)
RoHS 状态 — Compliant
Lead-Free — Yes

数据手册与资源

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