K9MDG08U5M vs K9DVGB8U5M 对比

详细并排对比 K9MDG08U5M 出自 Samsung Electronics 和 K9DVGB8U5M 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Samsung Electronics
K9MDG08U5M K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M - 16Gb x8 MLC NAND Flash TSOP1-48 | Samsung

K9MDG08U5M ✓ 量产中
Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ 量产中

规格对比

参数 K9MDG08U5M K9DVGB8U5M
品牌 Samsung Electronics Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $35.50 $3.05
存储器类型 MLC Large Block NAND Flash NAND Flash
Density 16 Gbit (2 GB) —
存储组织 16G x 8 bit [DATA_NEEDED: capacity organization]
Cell Type MLC (2 bits per cell) —
Supply Voltage Min 2.7 V —
Supply Voltage Max 3.6 V —
接口 Asynchronous x8 multiplexed address/data Asynchronous x8-bit I/O
封装 48-pin TSOP1 dual stacked, 12 mm x 20 mm [DATA_NEEDED: package type and dimensions]
Terminals 48 —
Circuits 1 —
Die Configuration Dual stacked —
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: temperature range]
Page Size [DATA_NEEDED: page size] [DATA_NEEDED: main page size]
Block Size [DATA_NEEDED: block size] [DATA_NEEDED: erase block size]
Page Read Time (tR) [DATA_NEEDED: tR] —
Program Time (tPROG) [DATA_NEEDED: tPROG] [DATA_NEEDED: page program time]
RoHS 状态 unknown [DATA_NEEDED: RoHS compliance]
电源电压 — [DATA_NEEDED: VCC range]
Read Time (tR) — [DATA_NEEDED: page read cycle time]
Erase Time (tBERS) — [DATA_NEEDED: block erase time]
Endurance — [DATA_NEEDED: program/erase cycles]
Data Retention — [DATA_NEEDED: retention specification]
Access Interface Signals — CLE, ALE, WE, RE, CE, R/B, WP
Bad Block Management — Host-managed (controller ECC and bad-block table required)

数据手册与资源

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