K9XXG08UXM vs K9HCG08U1M 对比
详细并排对比 K9XXG08UXM 出自 Samsung Electronics 和 K9HCG08U1M 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | K9XXG08UXM | K9HCG08U1M |
|---|---|---|
| 品牌 | Samsung Electronics | Samsung Electronics |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | Obsolete | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $0.00 |
| 存储容量 | 2G x 8 Bit (2Gb) | — |
| Memory Cell Array Organization | (1G + 32M) bit x 8 bit | — |
| Data Register | (2K + 64) bit x 8 bit | — |
| 电源电压 | 2.7 V to 3.6 V | [DATA_NEEDED: supply voltage] |
| Page Size | (2K + 64) Byte | [DATA_NEEDED: page size] |
| Block Size | (256K + 8K) Byte | [DATA_NEEDED: block size] |
| Program Operation | Automatic Page Program, (2K + 64) Byte | — |
| Erase Operation | Automatic Block Erase, (256K + 8K) Byte | — |
| I/O Interface | 8-bit multiplexed address/data/command | — |
| Control Signals | CLE, ALE, CE, RE, WE, WP, R/B | — |
| Cell Type | SLC (single-level cell) NAND | — |
| 封装 | 48-pin TSOP | TSOP-48 (PDSO48) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: Operating Temperature] | -40C to +105C (TA) |
| Access Time (tR) | [DATA_NEEDED: Access Time] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS Status] | — |
| Memory Technology | — | MLC NAND Flash |
| Total Capacity | — | 64 Gbit |
| 存储组织 | — | 8G x 8 |
| 数据总线宽度 | — | 8 bit |
| 接口类型 | — | Asynchronous NAND (multiplexed address/data/command) |
| Read Time (tR) | — | [DATA_NEEDED: read time] |
| Program Time (tPROG) | — | [DATA_NEEDED: program time] |
| Program/Erase Cycles | — | [DATA_NEEDED: endurance] |
| Ready/Busy Output | — | Yes (R/B#) |
| Die Technology | — | Samsung E-die (per datasheet family) |
| Full Ordering Code | — | K9HCG08U1M-PCB0 / K9HCG08U1M-PCB0T00 |