M29F400FB55N3F2 vs M29F800FB55N3F2 对比

详细并排对比 M29F400FB55N3F2 出自 Micron Technology 和 M29F800FB55N3F2 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
M29F400FB55N3F2 M29F400FB55N3F2 - 4Mbit 55ns NOR Flash 48-TSOP | Micron

M29F400FB55N3F2 - 4Mbit 55ns NOR Flash 48-TSOP | Micron

M29F400FB55N3F2 ✓ 量产中
Micron Technology
M29F800FB55N3F2 M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron

M29F800FB55N3F2 ✓ 量产中

规格对比

参数 M29F400FB55N3F2 M29F800FB55N3F2
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.95 $2.47
存储器类型 NOR Flash —
Density 4 Mbit (4194 kbit) —
存储组织 256K x 16 / 512K x 8 1M x 8 / 512K x 16
Access Time 55 ns 55 ns
电源电压 5 V 5 V
接口 Parallel —
Boot Block Bottom boot block —
工作温度 -40C to +125C -40C to +125C
Program/Erase Controller Embedded byte/word program algorithms Embedded byte/word program algorithms
封装 48-TSOP I —
安装类型 Surface Mount Surface Mount
Standard Package Quantity 1500 units (Tape & Reel) —
Active/Standby Current [DATA_NEEDED: active and standby current] —
Erase/Program Endurance [DATA_NEEDED: endurance cycles] —
Data Retention [DATA_NEEDED: retention years] —
VIO Range [DATA_NEEDED: I/O voltage range] —
RoHS 状态 Compliant (lead-free build per F2 suffix) Compliant (lead-free terminations)
Memory Density — 8389 kbits (8 Mbit)
接口类型 — Parallel NOR
Boot Block Architecture — Bottom Boot Block
Temperature Grade — Automotive (AEC-Q100)
Package Type — 48-pin TSOP1
Package Shape — Rectangular (JESD designation TSOP1)
Terminal Count — 48
JESD-609 Termination Code — e3 (lead-free)
Packaging — Tape & Reel (T/R)

数据手册与资源

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