A3PE600-FGG256I - ProASIC3E 600K-Gate Flash FPGA | Microchip
料号： A3PE600-FGG256I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $56.9 | $569.00 |
| 100 | $51.2 | $5,120.00 |
| 500 | $46.1 | $23,050.00 |
| 1,000 | $41.8 | $41,800.00 |
A3PE600-FGG256I 概述
A Flash FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory rather than an external configuration ROM. In the programmable-logic hierarchy, it sits alongside SRAM FPGAs and CPLDs as a class of programmable logic ICs, but unlike SRAM-based devices it is a true single-chip solution: it powers up instantly, needs no boot PROM, and resists configuration readback, which improves system security.
Key features include live reprogrammability (the fabric can be reprogrammed without power-cycling in some flows), a low total cost of ownership from eliminating external configuration devices, and 1.5V core operation with low static power. The ProASIC3E variant adds embedded flash blocks and enhanced clocking resources for system-level designs up to approximately 350 MHz internal performance.
Architecturally, the fabric is built from VersaTiles - each configurable as a three-input LUT, or as a D-flip-flop/latch with enable - a unique third-generation flash FPGA structure inherited from the ProASIC family. The FGG256 package is footprint-compatible with the FG484 package, easing migration to higher I/O counts.
Typical applications include industrial control, communications line cards, secure single-chip logic, aerospace/defense systems, and power-up-critical designs where instant-on configuration is required.
Design consideration: flash FPGAs tolerate fewer program/erase cycles than SRAM reconfiguration, so plan reprogramming frequency accordingly; also verify I/O bank voltage assignments before pinout freeze.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： A3PE600-FGG256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： A3PE600-FGG256I （相同外形与封装尺寸） ——差异在于 Package, Configuration Memory, Process Technology, RoHS Status, Reprogrammability.
快速对比工具——选择替代料号进行并排对比：
A3PE600-2FGG256
✅ 直接替换✓ 有现货
$33.15 / 个
查看数据手册 →A3P600-FG256I
✅ 直接替换✓ 有现货
$23.1 / 个
查看数据手册 →M7AFS600-2FGG256I
✅ 直接替换✓ 有现货
$389.6 / 个
查看数据手册 →M1AFS1500-1FG256
✅ 直接替换✓ 有现货
$191.42 / 个
查看数据手册 →M1AFS250-FGG256I
✅ 直接替换✓ 有现货
$49.5 / 个
查看数据手册 →A3PE600-FGG484I
✅ 直接替换✓ 有现货
$44.03 / 个
查看数据手册 →A3PE600-FGG256I 最大额定值与电气特性
| Family | ProASIC3E Flash FPGA |
| System Gates | 600000 gates |
| Logic Elements (VersaTiles) | 13824 |
| User I/O | 165 |
| Embedded Flash Memory | 110592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Performance | 350 MHz |
| 封装 | 256-FBGA (S-PBGA-B256), 17 x 17 mm |
| Ball Pitch | 1.0 mm |
| Package Height | 1.6 mm |
| 工作温度 | -40C to +85C (Industrial) |
| 安装类型 | Surface Mount |
| Configuration Memory | On-chip Flash (non-volatile, single-chip) |
| RoHS 状态 | Compliant (lead free) |
| Process Technology | CMOS flash FPGA |
| Footprint Compatibility | FG256 and FG484 footprint-compatible packages |
A3PE600-FGG256I 1.6 mm 引脚配置指南
A3PE600-FGG256I（1.6 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： A3PE600-FGG256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
A3PE600-FGG256I 适用于 6 应用s: Industrial Control and Automation, Secure Single-Chip Logic, Aerospace and Defense Systems, Communications Line Cards, Instant-On Battery and Handheld Systems, Test and Measurement Instrumentation.
Industrial Control and Automation
The A3PE600-FGG256I fits industrial control because its non-volatile flash configuration means the controller logic is active the instant 1.5V core power arrives - no boot sequence, no external configuration PROM to fail in electrically noisy factory environments. With 13,824 VersaTiles and 165 user I/Os, it handles motor sequencing, I/O expansion, and protocol bridging (UART, SPI, CAN peripherals implemented in fabric) at up to ~350 MHz internal performance. Place it between sensors and a host MCU or as standalone deterministic logic; the single-chip design reduces BOM and improves MTBF in -40C to +85C cabinets.
推荐
Secure Single-Chip Logic
Flash FPGAs like the A3PE600-FGG256I are preferred for security-sensitive logic because the configuration is stored on-chip in flash and cannot be read back like an SRAM bitstream, and the absence of an external boot flash removes the most commonly attacked component on SRAM-FPGA boards. The 600K-gate fabric and 110,592 bits of embedded flash let designers co-locate encryption keys, look-up tables, and control logic on one chip. This suits authentication engines, secure boot front-ends, and anti-cloning logic in industrial and defense-adjacent products operating from a 1.5V core in the 17 x 17 mm FBGA.
推荐
Aerospace and Defense Systems
In aerospace and defense, the A3PE600-FGG256I's flash-based fabric avoids the configuration-upset behavior of SRAM FPGAs, since there is no volatile bitstream to corrupt, and its single-chip architecture eliminates the configuration device failure point in high-reliability builds. The industrial -40C to +85C rating supports many avionic module environments (verify program-specific qualification), and 165 user I/Os cover bus interfaces, backplane glue logic, and sensor aggregation. Designers should implement TMR and SEU-hardened RTL per Microchip reliability app notes, and confirm the exact speed-grade and screening requirements for the program.
推荐
Communications Line Cards
The ProASIC3E fabric, with 13,824 VersaTiles and ~350 MHz internal performance, handles line-card glue logic: framing, deserializer-to-processor bridging, LED/status control, and backplane handshaking. The 165 user I/Os support multiple I/O banks with per-bank voltage reference assignment - one VREF pin per minibank when using voltage-referenced standards, per the Microchip datasheet - enabling mixed 3.3V/2.5V/1.8V interfaces on a single device. Instant-on flash configuration means the line card is link-ready immediately after hot-swap power-up, and the 17 x 17 mm, 1.0 mm-pitch FBGA keeps board area competitive.
推荐
Instant-On Battery and Handheld Systems
Battery-powered instruments benefit from the A3PE600-FGG256I's near-zero configuration power overhead: the flash fabric requires no configuration energy at each power-up, so a handheld device becomes operational within milliseconds of switch-on, and the 1.5V core keeps active power low at typical glue-logic utilization. The single-chip solution (no boot PROM) saves board space and quiescent budget. With 110,592 bits of embedded flash, calibration constants and unit serial data are stored on-chip. Designers should size decoupling for I/O bank switching currents and confirm static versus dynamic current split in Libero power analysis.
推荐
Test and Measurement Instrumentation
Bench and rack instruments use the A3PE600-FGG256I for timing generation, trigger logic, and front-end sequencing, where the flash FPGA's deterministic instant-on behavior and low jitter supply of clean clocks matter. The 600K-gate fabric implements state machines, counters, and interface translators between USB/LAN modules and analog front ends, while 165 user I/Os provide dense channel connectivity from the 1.0 mm-pitch FBGA. Because reprogrammability allows field firmware updates in-system via JTAG with FlashPro, instruments can be feature-upgraded in the field without configuration-device changes.
推荐
推荐产品汇总
工程参考数据： A3PE600-FGG256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | A3PE600-2FGG256 | A3P600-FG256I | M7AFS600-2FGG256I | M1AFS1500-1FG256 | M1AFS250-FGG256I |
|---|---|---|---|---|---|---|
| Package | 256-FBGA (FGG256), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (FGG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-FBGA - same footprint | 256-FBGA (FG256) - same footprint | 256-FBGA (FGG256) - same footprint |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600K-class gates | 1500000 gates | 250000 gates |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Flash Memory | 110592 bits | 110592 bits | None (ProASIC3, no E blocks) | Fusion flash fabric (analog + flash) | Fusion flash fabric | Fusion flash fabric |
| Configuration Memory | On-chip flash (single-chip, instant-on) | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
关键差异点
- Embedded flash blocks in the fabric （对比 A3P600-FG256I)
- Identical die, faster speed grade as shortage fallback （对比 A3PE600-2FGG256)
- 1.5V core compatibility in legacy designs （对比 M7AFS600-2FGG256I)
- 165 user I/Os in compact 17 x 17 mm （对比 A3PE600-FGG484I)
设计说明
The A3PE600-FGG256I requires a 1.5V core rail plus I/O bank rails (typically 3.3V/2.5V/1.8V depending on I/O standards). Estimated: power consumption scales with toggle rate and utilization - run Microchip's Libero power calculator with your post-fit netlist before finalizing the regulator budget. Because flash FPGAs have near-zero configuration power, inrush is governed by ordinary rail ramp; still provide a clean monotonic 1.5V ramp and local bulk capacitance (e.g., 47uF plus 0.1uF per I/O bank) to handle simultaneous switching output noise.
The FGG256 package has a 1.0 mm ball pitch on a 17 x 17 mm body; use a standard 0.5 mm pad, NSMD geometry, and via-in-pad or dog-bone escape for inner rows. The datasheet states FG256 and FG484 are footprint-compatible families - if you may migrate to FG484 later, reserve board area and verify keep-out. Follow Microchip's ProASIC3E PCB layout guidelines for ball-map fanout and do not swap VREF ball assignments: when using voltage-referenced I/O standards, one I/O per minibank must be reserved as VREF.
Three common mistakes with this part: (1) choosing the commercial-temperature A3PE600-FGG256 for an industrial build - the 'I' suffix is mandatory for -40C to +85C; (2) assuming SRAM-FPGA design flows - use Libero SoC and FlashPro, not third-party SRAM toolchains; (3) freezing the pinout before running I/O bank analysis, which can strand VREF pins. Also verify speed-grade margins after recompiling on a substitute speed grade such as the -2 part.
Estimated: the 256-FBGA's 1.6 mm height plastic package dissipates moderate power at typical utilization. For worst-case junction temperature, use theta-JA from the ProASIC3E datasheet package chapter with your board's copper area; a 4-layer board with solid ground plane typically keeps theta-JA in the 30-40 C/W class for this package size. Verify TJ stays below the datasheet maximum at -40C to +85C ambient plus self-heating; if marginal, add ground-plane copper under the die shadow rather than a heatsink.
合规信息
Mouser listing describes A3PE600-FGG256I as LEAD FREE; Jotrin describes the FBGA-256 package as GREEN. REACH, halogen-free, and conflict-minerals status not stated in provided data.
