MC9S08AC8MFDE vs MC9S08AC32CFDE 对比
详细并排对比 MC9S08AC8MFDE 出自 NXP Semiconductors 和 MC9S08AC32CFDE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S08AC32CFDE - S08AC 8-bit MCU, 32KB Flash, 40MHz, QFN-48 | NXP
MC9S08AC32CFDE Nrnd规格对比
| 参数 | MC9S08AC8MFDE | MC9S08AC32CFDE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.78 | $3.02 |
| Core / Architecture | S08 (HCS08), 8-bit CISC | — |
| Program Flash | 8 KB (8K x 8) | — |
| RAM | 512 B | 1 KB |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| 电源电压 | 2.7 V to 5.5 V (3.3 V / 5 V supported) | — |
| ADC | 8-channel, 10-bit | 8-channel, 10-bit |
| Timers | 16-bit timer/PWM modules | 16-bit timer/PWM, plus additional 8-bit and 2-channel modules |
| Communication Interfaces | SCI (UART), SPI | SCI (UART) and SPI |
| I/O Pins | [DATA_NEEDED: number of GPIO] | — |
| 封装 | 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm) | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C | — |
| On-chip Oscillator | Yes (internal clock source) | — |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | Compliant | — |
| Core Architecture | — | S08 (HCS08 family, 8-bit CISC) |
| Program Memory (Flash) | — | 32 KB |
| Supply Voltage (VDD) | — | 2.7 V to 5.5 V |
| 工作温度范围 | — | -40 C to +125 C (automotive grade) |
| Number of I/O Pins | — | 38 |
| Debug Interface | — | Single-wire BDM (Background Debug Mode) |
| Internal Clock Source | — | Yes (ICS - Internal Clock Source) |
| Temperature Grade | — | Automotive (AEC-Q100 qualified per NXP product page) [DATA_NEEDED: specific AEC-Q100 grade letter] |
| 数据总线宽度 | — | 8-bit |
| MSL (Moisture Sensitivity Level) | — | MSL3 (per QFN-EP package, JEDEC J-STD-020) [DATA_NEEDED: exact floor life] |
| RoHS Compliance | — | Compliant (per NXP product page) |
| Lead-Free | — | Yes (per distributor packaging datasheet) |
| 生命周期状态 | — | NRND (Not Recommended for New Designs, per NXP product page) |