MC9S08DV16CLC vs MC9S08DV32CLC 对比

详细并排对比 MC9S08DV16CLC 出自 NXP Semiconductors 和 MC9S08DV32CLC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DV16CLC MC9S08DV16CLC - 8-bit 40MHz 16KB Flash MCU w/ CAN | NXP | LQFP-32

MC9S08DV16CLC - 8-bit 40MHz 16KB Flash MCU w/ CAN | NXP | LQFP-32

MC9S08DV16CLC ✓ 量产中
NXP Semiconductors
MC9S08DV32CLC MC9S08DV32CLC - 8-bit S08 MCU, 32KB Flash, 40MHz, 32-LQFP | NXP

MC9S08DV32CLC - 8-bit S08 MCU, 32KB Flash, 40MHz, 32-LQFP | NXP

MC9S08DV32CLC ✓ 量产中

规格对比

参数 MC9S08DV16CLC MC9S08DV32CLC
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $4.32 $4.65
Core S08 (8-bit CISC) —
Maximum CPU Frequency 40 MHz 40 MHz
Program Memory (Flash) 16 KB (16K x 8) —
RAM 1 KB —
Supply Voltage Range 2.7 V to 5.5 V [DATA_NEEDED: Vdd min/max]
I/O Pins 25 —
ADC 10-channel, 12-bit —
CAN Controller 1 x CAN 2.0 —
Serial Interfaces I2C, LINbus (SCI), SCI, SPI —
PWM Channels Yes (integrated PWM module) —
Timers Multiple (incl. RTC) —
Watchdog Timer (WDT) Yes —
Low-Voltage Detect (LVD) Yes —
Power-On Reset (POR) Yes —
Debug Interface Background Debug Mode (BDM) —
封装 32-LQFP (7x7 mm) 32-LQFP (7x7 mm)
安装类型 Surface Mount Surface Mount
工作温度 -40C to +85C (industrial) —
RoHS 状态 Compliant Compliant
Core Architecture — S08 (HCS08) - 8-bit
Program Memory (FLASH) — 32 KB (32K x 8)
RAM Size — 2 KB
Number of I/O Pins — 25
Package Pin Count — 32
Terminal Form — GULL WING
Package Code — LQFP
Package Shape — SQUARE
Temperature Grade — INDUSTRIAL (-40C to +85C)
Oscillator Type — External
Packaging — Tray

数据手册与资源

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