MC9S12DT256MPVE vs MC9S12XDT256MAL 对比
详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12XDT256MAL 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256MPVE NrndNXP Semiconductors
MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP
MC9S12XDT256MAL Nrnd规格对比
| 参数 | MC9S12DT256MPVE | MC9S12XDT256MAL |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $14.36 | $15.85 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum CPU Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | 256KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| 数据总线宽度 | 16-bit | — |
| 电源电压 | 2.35 V to 2.75 V (regulated core) | 2.5V / 5V |
| I/O Pins | 91 | — |
| ADC | 2 x 10-bit, 8 channels each (16 channels total) | 10/12-bit (model dependent) |
| Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) | CAN, SCI (UART), SPI, I2C |
| 封装 | 112-LQFP (20x20 mm) | 112-pin LQFP (20x20 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | -40C to +125C (automotive grade) | -40C to +125C (automotive grade) |
| Debug Interface | Background Debug Mode (BDM) + JTAG | — |
| RoHS 状态 | Compliant | Compliant |
| 生命周期状态 | NRND (Not Recommended for New Designs) | — |
| Core Architecture | — | HCS12X (16-bit CISC) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Maximum CPU Clock | — | 80 MHz |
| Bus Frequency | — | 40 MHz (typical, derived from 80MHz core) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Instruction Set Compatibility | — | Upward compatible with HCS12 |
| Co-processor | — | XGATE peripheral co-processor |
| Automotive Qualification | — | AEC-Q100 qualified |
| MSL 等级 | — | 3 (per JEDEC J-STD-020) |