MC9S12DT256MPVE vs MC9S12XDT256MAL 비교

다음의 상세 나란히 비교: MC9S12DT256MPVE 제조: NXP Semiconductors 및 MC9S12XDT256MAL 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12XDT256MAL MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP

MC9S12XDT256MAL - 16-bit HCS12X MCU, 256KB Flash, 80MHz | NXP

MC9S12XDT256MAL Nrnd

사양 비교

파라미터 MC9S12DT256MPVE MC9S12XDT256MAL
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $14.36 $15.85
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 256 KB 256KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
데이터 버스 폭 16-bit —
공급 전압 2.35 V to 2.75 V (regulated core) 2.5V / 5V
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 10/12-bit (model dependent)
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) CAN, SCI (UART), SPI, I2C
패키지 112-LQFP (20x20 mm) 112-pin LQFP (20x20 mm)
실장 유형 Surface Mount Surface Mount
동작 온도 -40C to +125C (automotive grade) -40C to +125C (automotive grade)
Debug Interface Background Debug Mode (BDM) + JTAG —
RoHS 상태 Compliant Compliant
수명 주기 상태 NRND (Not Recommended for New Designs) —
Core Architecture — HCS12X (16-bit CISC)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
Maximum CPU Clock — 80 MHz
Bus Frequency — 40 MHz (typical, derived from 80MHz core)
Number of I/O Pins — [DATA_NEEDED: I/O count]
PWM Channels — [DATA_NEEDED: PWM channel count]
Instruction Set Compatibility — Upward compatible with HCS12
Co-processor — XGATE peripheral co-processor
Automotive Qualification — AEC-Q100 qualified
MSL 레벨 — 3 (per JEDEC J-STD-020)

데이터시트 & 자료

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